Coupled growth in directional solidification
of peritectic alloys |
FU Heng-zhi,, LUO Liang-shun, SU Yan-qing, GUO Jing-jie,LI Shuang-ming, LIU Lin |
349 |
Oxidized characteristic and oxidized
mechanism of TaC coating |
LI Guo-dong, XIONG Xiang, HUANG Bai-yun, ZENG Yu-lin |
360 |
Copper nitride thin films prepared by
radio frequency magnetron sputtering |
XIAO Jian-rong,, XU Hui, LIU Xiao-liang,LI Yan-feng, ZHANG Peng-hua, JIAN Xian-zhong |
368 |
Interfacial microstructure of laser-brazed joint
between TiNi shape memory alloy and stainless steel |
LI Ming-gao, SUN Da-qian, QIU Xiao-ming |
373 |
Effects of process conditions on microstructure
and corrosion-resistance of electrodepositing Pd-Co alloy |
GUAN Xiao-jie, ZHONG Mei-e,XIAO Yao-kun,CHEN Zong-zhang |
378 |
High pressure solidification microstructure
and stability of Al-9.6%Mg alloy |
WANG Zhen-ling, WANG Hong-wei, WEI Zun-jie, CAO Lei |
384 |
Effect of 0.10% Ce on intermetallic compounds
at Sn-0.7Cu-0.5Ni/Cu interface |
LU Bin, WANG Juan-hui, LI Hui, ZHU Hua-wei, JIAO Xian-he |
390 |
Microstructure and properties of
Al-9.0Zn-2.5Mg-1.2Cu-0.12Sc-0.15Zr alloy |
DAI Xiao-yuan,, XIA Chang-qing, SUN Zhen-qi, HUA Man-yu, WU Yin |
396 |
Preparation and oxidation resistance
of Mg nanopowders |
SUN Wei-min, XU Dong-nian, ZHENG Zhuo,ZHANG Yi, LIU Zheng |
402 |
Preparation and properties of Fe-rich
bulk Fe-Nd-Al amorphous alloys |
CHEN Ding,, CHEN Zhen-hua, A. Inoue |
406 |
Interfacial reactions between Sn-Cu solder
alloy and Cu/Ni coatings during reflow soldering |
DIAO Hui, WANG Chun-qing, ZHAO Zhen-qing,TIAN Yan-hong, KONG Ling-chao |
410 |
Ageing precipitation behavior of high
purity Al-Cu-Mg-Ag alloy |
ZHANG Kun, DAI Sheng-long, HUANG Min,YANG Shou-jie, YAN Ming-gao |
417 |
Characterization and sintering behavior of ultra-fine
Mo-Cu powder prepared by gelatinization-coreduction method |
CHENG Ji-gui, GONG Yan-fei, SONG Peng, LI Jie |
422 |
Microstructure and properties of copper
alloy based nano-AlN composite |
DENG Jing-quan, WU Yu-cheng, WANG Wen-fang,HUANG Xin-min |
428 |
Effect of extrusion and annealing technology on
microstructure and texture of
AZ31 magnesium alloy |
QU Jia-hui,, LI Si-jun, ZHANG Zheng-gui,WANG Fu, ZUO Liang |
434 |
Determination of embedding depth of abrasive grains
on working surface of single-layer brazed CBN grinding wheel |
DING Wen-feng, XU Jiu-hua, FU Yu-can, SU Hong-hua,XIAO Bing, ZHOU Lai-shui |
441 |
Non-sinusoidal oscillation amplitude for
continuous casting mold with high casting speed |
MENG Xiang-ning, ZHU Miao-yong,CHENG Nai-liang, JIANG Zhong-kuai |
446 |
Discrepant analysis of iron precipitate
synthesized by two strains of different iron-oxidizing bacteria |
GAO Jian,, PENG Hong, LI Bang-mei, WU Xue-ling,DING Jian-nan, QIU Guan-zhou |
453 |
Preparation of strontium carbonate from celestite
concentrate and its solution chemistry mechanism |
LI Guang-hui, LIU Mu-dan, HUANG Wu-hua, JIANG Tao, FAN Xiao-hui |
459 |
Electrochemical behavior of chalcopyrite at normal
temperature in acidic solution |
LU Yi-ping, JIANG Xiao-hui, FENG Qi-ming, OU Le-ming, ZHANG Guo-fan |
465 |
Mechanism of improving permeability in dump by
effect of electric field |
ZUO Heng, WANG Yi-ming, CHEN Xue-song, JIANG Huai-chun |
471 |
Microwave-absorbing characteristics of mixtures about different
proportions of carbonaceous reducer and ilmenite in microwave field |
HUANG Meng-yang, PENG Jin-hui, HUANG Ming,ZHANG Shi-min, LI Yu, LEI Ying |
476 |
Effects of temperature modification of mesophase pitches
on structure and electrochemical performance of activated carbons |
LI Jie, SONG Hai-shen, LI Jian, LI Jing, LAI Yan-qing,ZHANG Zhi-an, LU Hai |
481 |
| Equilibrium of hydroxyl complex ions in Cd2+-H2O system |
CHAI Li-yuan, CHANG Hao, WANG Yun-yan,SHU Yu-de,LI Jing, YUAN Lin, WANG Pu, FANG Yan, ZHAO Kun |
487 |
| Trivalent chromium passivation based on zincate plating |
ZENG Zhen-ou, ZOU Jin-guang,ZHAO Guo-peng, XIAO Zheng-wei |
492 |
Synthesis and application of a new
high-molecular-mass hydroxamic acid
flocculant containing phenyl |
CHEN Feng, WANG Lian-song, BI Shi-wen,XIE Zhi-hui, JIA Zhi-jun |
498 |
