(西安交通大学 金属材料强度国家重点实验室, 西安 710049)
摘 要: 采用真空高温热压熔渗烧结工艺制备出密度为99.5%的纳米晶W-Ｃu电触头材料。 其组织结构和晶粒大小采用SEM, TEM和XRD观察。 同时就纳米晶W-Cu电触头材料的硬度、 电导率、 耐电压强度和抗电弧烧蚀性与传统粉末冶金工艺制备的进行了对比分析。 结果表明， 纳米晶W-Cu电触头材料的硬度、 抗电弧烧蚀性及耐电压稳定性远优于传统熔渗法的W-Cu合金，而电导率两者相差不大。
关键字: 机械合金化； 纳米晶材料； W-Cu电触头； 热压烧结
（State Key Laboratory of Metal Material Strength,
Xi′an JiaoTong University, Xi′an 710049, China）
Abstract:Nanostructured (NS) W-Cu composite powder is prepared by the high energy ball milling or mechanical alloying(MA), and W-Cu electrical contact material is fabricated by hot pressed sintering in the vacuum, and nanostructural evolution with milling time is analyzed by SEM, XRD and TEM. The MA NS W-Cu powder compacts sintered at 1200℃ show the high sinterability, resulting in a nearly full density. The microstructure uniformity, hardness, electric erosion and stability of breakdown voltage for NS W-Cu electrical contact material excel that of conventional PM W-Cu alloy, but the electric conductivity is equivalent.
Key words: mechanical alloying; nanostructured materials; hot-press sintering; W-Cu alloy
