文章编号：1004-0609(2001)S2-0016-05
微波焊接进展
(武汉理工大学 材料复合新技术国家重点实验室，武汉 430070)
摘 要: 阐述了微波焊接过程中微波和物质作用的机理、陶瓷的升温特征、实验装置的优化以及近年来国内外微波焊接陶瓷的发展状况，分析了焊接过程中存在的问题，并对微波焊接作出了展望。
关键字: 微波焊接； 陶瓷； 介电损耗
Overview of microwave joining
（State Key Laboratory of Advanced Technology for Materials Synthesis
and Processing,Wuhan University and Technology, Wuhan 430070, P.R.China）
Abstract:The interaction mechanism of microwave with ceramics, the characteristics of temperature change and the equipment of microwave joining were expatiated, and the development on microwave joining in recent years was provided, then some problems in the microwave joining process were refered. At last a prospect on microwave joining technology was made.
Key words: microwave joining; ceramics; dielectric loss factor
