(东南大学 无线电工程系 射频与光电集成电路研究所,
南京 210096)
摘 要: 介绍了2.5～40Gb/s的光通信收发器处理芯片的研究情况，芯片功能包括复接器、 激光驱动器、 前置放大器与限幅放大器、 时钟恢复和数据判决电路以及分接器。 采用的工艺有0.18/0.25μmCMOS, 0.15/0.2μmGaAs PHEMT和2μmGaAsHBT等， 采用多项目晶圆方式和国外先进的工艺生产线进行芯片制作。研究中采用了高速电路技术和微波集成电路技术， 如采用SCFL电路、超动态D触发器电路、同步注入式VCO、分布放大器、 共面波导和传输线技术等。 在SDH 155Mb/s~2.5Gb/s的收发器套片设计方面已实现产品化。 还介绍了10Gb/s的收发器套片产品化问题， 如封装问题等， 讨论了40Gb/s以上速率芯片技术的发展趋势，包括高速器件建模和测试问题等。
关键字: 光纤通信； SDH； 超高速集成电路； 收发器； CMOS； GaAs; PHEMT; HBT; SCFL; VCO
（Department of Radio Engineering,
Southeast University, Nanjing 210096, China）
Abstract:The transceiver integrated circuits tehcnology of 2.5-40Gb/s was studied for optical-fiber communication. The ICs include multiplexer, laser-driver, preamplifier and limiting amplifier, clock recovery and data decision, demultiplexer. The technologies of 0.18/0.25μm CMOS, 0.15/0.2μm GaAs PHEMT and 2μm GaAs HBT were used to research and design the ICs. The MPW(multi-projet wafer) method and advanced foundry technology were adopted to produce the ICs. The high-speed circuit technology and MMIC technology were adopted to research our circuit, such as SCFL structure, super-dynamic DFF, synchronization injection VCO, distributed amplifier, coplanar waveguide and transmission-line technology. The 155Mb/s-2.5Gb/s SDH transceiver ICs was produced. The developing trand of above 40Gb/s ICs design technology was discussed, including high-speed device modeling and the ICs testing.
Key words: optical-fiber; communication; SDH; super-high speed integrated circuit; transceiver; CMOS; GaAs; PHEMT; HBT; SCFL; VCO
