中国有色金属学报(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 19 Special 2 September 2009 |
（1. School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China;
2. Academy of Fundamental and Interdisciplinary Sciences, Harbin Institute of Technology,
Harbin 150001, China;
3. Center for Composite Materials, Harbin Institute of Technology, Harbin 150001, China）
Abstract:TiB2p/Cu composites with high reinforcement content (φp=50%, 58% and 65%) for electronic packaging applications were fabricated by squeeze casting technology. The microstructures and thermo-physical properties of the TiB2p/Cu composites were investigated. The results show that TiB2 particles are homogeneous and distribute uniformly, and the TiB2-Cu interfaces are clean and free-from interfacial reaction products and amorphous layers, the densifications of the TiB2p/Cu composites are higher than 98.2%. The mean linear coefficients of thermal expansion at 20−100 ℃ for TiB2p/Cu composites range from 8.3×10−6 to 10.8×10−6/K and decrease with increasing volume fraction of TiB2. The experimental coefficients of thermal expansion agree well with the predicted values based on Turner’s model. The thermal conductivities of TiB2p/Cu composites range from 167.3 to 215.4 W/(m∙K), decreasing with increasing volume fraction TiB2.
Key words: TiB2p/Cu composites; densification; coefficient of thermal expansion; thermal conductivity
