中国有色金属学报(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 34 No. 1 January 2024 |
（1. State Key Laboratory of Nonferrous Metals and Processes, GRINM Group Co., Ltd., Beijing 100088, China;
2. GRIMAT Engineering Institute Co., Ltd., Beijing 101407, China;
3. General Research Institute for Nonferrous Metals, Beijing 100088, China）
Abstract:Different interfacial structures of diamond/Cu composites were synthesized by varying the boron (B) content. The microstructural, thermal, and mechanical properties of the composites were investigated. The results showed that diamond/Cu-B composites had a high thermal conductivity of 695 W/(m·K) and high bending strength of 535 MPa attributed to the formation of a micron-scale dentate B4C interface structure. The dentate B4C provided dual functions of metallurgical bonding and mechanical meshing for interface bonding. A semi-coherent interface was formed between the diamond and B4C, where the diamond (111) and B4C (104) planes were parallel. The micro/nano-scale dentate structure improved the phonon transmission efficiency and bonding strength at the interface.
Key words: metal matrix composites (MMCs); diamond/Cu composites; thermal conductivity; interfacial structures
