(1. 金川集团股份有限公司 镍钴资源综合利用国家重点实验室，金昌 737100；
2. 兰州理工大学 省部共建有色金属先进加工与再利用国家重点实验室，兰州 730050；
3. 兰州理工大学 白银新材料研究院，白银 730900)
摘 要: 为了研究可溶性/不可溶性阳极隔膜电解工艺生产的电解镍与电积镍在结构和性能之间的差异，利用XRD、SEM等分析手段进行择优取向、晶粒尺寸、微观组织及断口形貌等计算和分析。结果表明：电解镍的品质要明显优于电积镍的品质，电积镍和电解镍表面(200)面都呈现出单一高择优生长，截面(111)面和(200)面也都呈双择优取向。两种电沉积镍的晶粒尺寸都为几十个纳米，电解镍平均晶粒尺寸为34.3 nm，小于电积镍的平均晶粒尺寸47.6 nm，说明电解镍的晶粒更为细小。两种电沉积镍的生长机制都是由开始时的螺旋位错生长变为累积长大机制，两者表面显微组织都有平行于表面的棱锥状脊阶，部分区域出现类似于菌落状或胞状形态。两者截面显微组织都为层片状，靠近始积片区域沉积层晶粒为细小等轴晶，越远离始极片区域沉积层晶粒尺寸越大且择优取向越明显。但电解镍表面脊阶较为集中且数量庞大，而电积镍脊阶分散且数量较少，多以零散菌落状或胞状形态分布。两种电沉积镍塑性都较好，都为韧性断裂。电积镍的抗拉强度和硬度要高于电解镍，但塑性较电解镍差。电积镍韧窝内分布着较多的球形或不规则形状的夹杂物，而电解镍鲜见夹杂物存在。
关键字: 电沉积；晶粒尺寸；择优取向；塑韧性；断口形貌
（1. State Key Laboratory for Comprehensive Utilization of Nickel and Cobalt Resources, Jinchuan Group Co., Ltd., Jinchang 737100, China;
2. State Key Laboratory of Advanced Processing and Recycling of Non-ferrous Metal, Lanzhou University of Technology, Lanzhou 730050, China;
3. Baiyin Novel Materials Research Institute, Lanzhou University of Technology, Baiyin 730900, China）
Abstract:This paper studies the differences of the structure and properties between the two types of electrodeposited nickel produced by soluble/insoluble anode diaphragm electrolysis process. And XRD, SEM and other analytical methods used to determine and analyze the preferred orientation, grain size, microstructure and fracture morphology, etc. The results show that the quality of electrolytic nickel is significantly better than that of electrowinning nickel. The surface (200) of electrowinning nickel and electrolytic nickel shows a single highly preferred growth, and the cross section (110) and (200) also show double preferred orientation. The grain sizes of the two kinds of electrodeposited nickel were tens of nanometers, and the average grain size of electrolytic nickel is 34.3 nm, which is smaller than the average grain size (47.6 nm) of electrodeposited nickel, and the grain size of electrolytic nickel is finer. The growth mechanisms of the two kinds of electrodeposited nickel are from spiral dislocation growth to cumulative growth at the beginning. The surface microstructures of both sides have ridges parallel to the surface, most of which are pyramidal, and some areas are similar to colony or cellular morphology. In addition, the cross-sectional microstructures of both are “lamellar” structures, and the grains in the deposition layer near the starting plate are fine equiaxed grains. However, the farther away from the starting plate, the larger the grain size and the more obvious the preferred orientation. The difference between the both sides is that the ridge steps on the surface of electrolytic nickel are more concentrated and the number is large, while the ridge steps of electrodeposition nickel are more scattered and less, mostly in the form of scattered colonies or cells. The two types of electrodeposited nickel have good plasticity, and both are ductile fractures. The tensile strength and hardness of electrowinning nickel are higher than those of electrolytic nickel, but its plasticity is worse than that of electrolytic nickel. There are more spherical or irregular-shaped inclusions distributed in the dimples of electrowinning nickel, while electrolytic nickel is the opposite.
Key words: electrodeposition; grain size; preferred orientation; plasticity and toughness; fracture morphology
