Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

您目前所在的位置:首页 - 期刊简介 - 详细页面

中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第32卷    第7期    总第280期    2022年7月

[PDF全文下载]    [HTML全文阅读]    

    

文章编号:1004-0609(2022)-07-1889-11
Al-Cu-Li合金厚板不均匀特征组织对蠕变时效成形的影响
张劲1, 2,郑昌军1,陈明安1, 2

(1. 中南大学 轻合金研究院,长沙 410083;
2. 中南大学 高性能与复杂制造国家重点实验室,长沙 410083
)

摘 要: 采用单轴恒应力蠕变试验、电子背散射衍射(EBSD)和透射电子显微镜(TEM)技术等实验手段,研究了Al-Cu-Li合金厚板的不均匀组织特征对其蠕变时效成形过程的影响。结果表明:厚向不均匀组织的差异性表现出明显不同的蠕变变形行为,靠近中心层的特征组织具有更高的蠕变量和更快的初始蠕变速率;厚板特征组织的晶粒尺寸与蠕变变形之间无确定的相关性,而位错运动是影响蠕变量的主要因素;晶粒尺寸在蠕变时效前后变化微小,但蠕变时效后小角度晶界比例存在不同程度的提高。此外,厚板不同特征组织会影响蠕变时效过程中强化相T1的析出行为,靠近中心层的特征组织在蠕变过程中会形成更多的位错缠结,促使T1相大量析出和致密分布。

 

关键字: Al-Cu-Li合金;厚板;蠕变时效成形;微观组织

Effect of inhomogeneous characteristic structure on creep aging forming in Al-Cu-Li alloy thick plates
ZHANG Jin1, 2, ZHENG Chang-jun1, CHEN Ming-an1, 2

1. Research Institute of Light Alloy, Central South University, Changsha 410083, China;
2. State Key Laboratory of High Performance and Complex Manufacturing, Central South University, Changsha 410083, China

Abstract:The effect of inhomogeneous structure on creep aging process of Al-Cu-Li alloy thick plate was studied by uniaxial constant stress creep test, electron backscatter diffraction (EBSD) and transmission electron microscope (TEM) techniques. The results show that the difference of the thick-direction inhomogeneous structures exhibits obvious different creep deformation behavior, and the characteristic structure near the center layer has a higher creep and a faster initial creep rate. There is no definite correlation between the grain size of the characteristic structure of the thick plate and the creep deformation, and the dislocation movement is the main factor affecting the creep. The grain size changes slightly before and after creep aging, but the proportion of small-angle grain boundaries increases to a varying degree after creep aging. In addition, the different characteristic microstructures of the thick plate could affect the precipitation behavior of the strengthening phase T1 during the creep aging process. The characteristic structure near the center layer forms more dislocation entanglements during the creep process, which promotes a large number of precipitation and dense distribution of T1 phase.

 

Key words: Al-Cu-Li alloy; thick plate; creep aging forming; microstructure

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

主管:中国科学技术协会 主办:中国有色金属学会 承办:中南大学
湘ICP备09001153号 版权所有:《中国有色金属学报》编辑部
------------------------------------------------------------------------------------------
地 址:湖南省长沙市岳麓山中南大学内 邮编:410083
电 话:0731-88876765,88877197,88830410   传真:0731-88877197   电子邮箱:f_ysxb@163.com