(1. 中北大学材料科学与工程学院，太原030051；
2. 山西中兵铸造有限责任公司，大同037006；
3. 山西柴油机工业有限责任公司，大同037006)
摘 要: 以38CrMo合金钢和Al-Si-Cu-Mg高强铸造铝合金为原料进行固-液复层铸造。在720℃下进行了5~20min不同时间热浸镀纯Al、Al-Si合金实验，制备出界面冶金结合良好的钢/铝复层材料。研究热浸镀时间、热浸镀成分对钢/铝界面显微组织和力学性能的影响。结果表明：热浸镀纯Al时，界面金属间化合物为Fe2Al5和FeAl3；热浸镀Al-Si合金时，界面金属间化合物为Fe2Al5和Al8Fe2Si。热浸镀纯Al、Al-Si合金界面显微硬度最高分别为535.2HV和580.6HV，剪切强度最大分别为28.4MPa和39.4MPa。热浸镀时间相同时，热浸镀纯Al形成的金属间化合物层厚度大于热浸镀Al-Si合金形成的金属间化合物层厚度，主要原因是Si元素的存在降低了Fe、Al原子的扩散系数，阻碍了Fe、Al原子之间的扩散，使金属间化合物层的生长受到抑制。
关键字: 钢；铝；热浸镀；界面结合；微观结构；力学性能
（1. School of Materials Science and Engineering, North University of China, Taiyuan 030051, China;
2. Shanxi Zhongbing Foundry Co., Ltd., Datong037006, China;
3. Shanxi Diesel Engine Industry Co., Ltd., Datong 037006, China）
Abstract:38CrMo alloy steel and Al-Si-Cu-Mg high strength casting aluminum alloy were used as raw materials for solid-liquid composite casting. The experiments of hot-dip plating pure Al and Al-Si alloy at 720℃ for 5-20min were carried out, and the steel/aluminum composite with good interface metallurgical bonding was prepared. The effects of hot-dip time and hot-dip composition on the microstructure and mechanical properties of steel/aluminum interface were studied. The results show that the interfacial intermetallic compounds are Fe2Al5 and FeAl3 during hot-dip pure aluminum; and the interfacial intermetallic compounds are Fe2Al5 and Al8Fe2Si during hot-dip Al-Si alloy. The thickness of intermetallic compound layer increases with the increase of hot-dip time.The maximum interfacial microhardness of hot-dip pure aluminum and Al-Si alloy are 535.2HV and 580.6HV respectively, and the maximum shear strength are 28.4MPa and 39.4MPa, respectively. At the same hot-dip time, the thickness of intermetallic compound layer formed by hot-dip pure Al is larger than that formed by hot-dip Al-Si alloy, mainly because the existence of Si element reduces the diffusion coefficient of Fe and Al atoms, hinders the diffusion between Fe and Al atoms, and inhibits the growth of intermetallic compound layer.
Key words: steel; aluminum; hot-dip; interface bonding; microstructure; mechanical property
