(哈尔滨理工大学 材料科学与工程学院，哈尔滨 150040)
摘 要: 研究SAC305/Ni界面在260 ℃下液态保温、150 ℃下固态时效的镀Ni层消耗及界面IMC的生长规律。将数据拟合，建立液态保温、固态时效下镀Ni层消耗及界面IMC生长的数值模型。结果表明：焊点在液态保温条件下，停留时间从1 min到50 min，镀Ni层消耗量与停留时间t0.2217呈正比关系，界面IMC生长厚度与停留时间t0.3494呈正比关系。在固态时效条件下，时效时间从168 h到672 h，镀Ni消耗量与时效时间t1/2呈正比关系，界面IMC生长厚度与时效时间t1/2呈正比关系。与固态时效界面IMC生长相比，液态保温下的界面IMC生长更加迅速。为了减少镀Ni层的消耗，避免形成过厚的IMC层，准确控制液态停留时间是十分重要的。
关键字: 液态保温；固态时效；镀Ni层消耗；IMC生长；演变规律
（School of Material Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China）
Abstract:The evolution of interfacial IMC and the consumption of Ni plated layer of the SAC305/Ni joint during liquid insulation at 260 ℃and solid aging at 150 ℃ were investigated. Numerical models of Ni layer consumption and interfacial IMC growth under the condition of liquid thermal insulation and solid aging were established by fitting the data. The experimental results show that during the liquid holding time is between 1 to 50 min, the consumption of Ni layer is proportional to the holding time t0.2217 and the growth thickness of interfacial IMC is proportional to the holding time t0.3494. During the solid aging time is from 168 h to 672 h. The consumption of Ni is proportional to the aging time t1/2. The growth thickness of interfacial IMC is proportional to the aging time t1/2. Compared with the interface IMC growth under solid aging, the interface IMC growth under liquid insulation is faster. In order to reduce the consumption of the Ni layer and avoid the formation of an excessive thick IMC layer, it is particularly important to control the liquid holding time accurately.
Key words: liquid insulation; solid aging; Ni layer consumption; intermetallic compounds growth; evolution law
