(昆明理工大学 机电工程学院，昆明 650500)
摘 要: 为深入理解单晶锗的纳米切削特性，提高纳米锗器件的光学表面质量，使用纳米划痕仪对单晶锗进行多次刻划实验研究，并测得其在刻划过程中的切削力、摩擦因数。利用扫描电子显微镜(SEM)观测沟槽的显微形貌及切屑堆积情况，使用原子力显微镜(AFM)检测其多次刻划过程中的弹性模量及表面粗糙度。结果表明：随着刻划次数的增多，切削力、摩擦因数，表面粗糙度均在逐渐增大，而弹性模量在逐渐变小，这些现象产生的根本原因是在刻划过程中位错的产生及单晶锗晶格遭到破坏引起的能量波动。此外，随着刻划次数的增加，沟槽两侧的切屑堆积越来越明显。
关键字: 单晶锗；多次刻划；切削力；弹性模量
（Faculty of Mechanical and Electrical Engineering, Kunming University of Science and Technology, Kunming 650500, China）
Abstract:In order to understand the nanoscale cutting characteristics of single crystal germanium and improve the optical surface quality of the nanoscale germanium, the nanoscratch instrument was used to study the single crystal germanium, and the cutting force and friction coefficient in the process were measured. Scanning electron microscope (SEM) was used to observe the micromorphology and chip accumulation of the grooves. The elastic modulus and surface roughness were measured by atomic force microscopy (AFM). The results show that the cutting force, the friction coefficient and the surface roughness increase with the increase of the number of stroke, and the modulus of elasticity decreases gradually. The root cause of these phenomena is due to the dislocation in the etching process and the energy fluctuation caused by the destruction of the single crystal germanium lattice. In addition, with the increase of the number of chips, the accumulation of chips on both sides of the groove is more and more obvious.
Key words: single crystal germanium; multiple characterization; cutting force; elastic modulus
