Abstract:Mg/Cu bimetal composites were prepared by compound casting method, and the microstructure evolution, phase constitution and bonding strength at the interface were investigated. It is found that a good metallurgical bonding can be achieved at the interface of Mg and Cu, which consists of two sub-layers, i.e., layer I with 30 μm on the copper side composed of Mg₂Cu matrix phase, on which a small amount of dendritic MgCu₂ phase was randomly distributed; layer II with 140 μm on the magnesium side made up of the lamellar nano-eutectic network Mg₂Cu+(Mg) and a small amount of detached Mg₂Cu phase. The average interfacial shear strength of the bimetal composite is measured to be 13 MPa. This study provides a new fabrication process for the application of Mg/Cu bimetal composites as the hydrogen storage materials.

Key words: Mg/Cu bimetal composites; compound casting; interfacial bonding mechanism; interfacial microstructure; interfacial mechanical behavior