(中南大学 化学化工学院，长沙 410083)
摘 要: 采用交流阻抗(EIS)、塔菲尔(Tafel)极化曲线和循环伏安法(CV)研究了铜表面3-己基-4-氨基-1,2,4-三唑-5-硫酮(HATT)和5-己基-1,2,4-三唑-3-硫酮(HXTT)自组装膜抗0.5 mol/L盐酸溶液腐蚀的电化学性能。通过接触角、吸附热力学和X射线光电子能谱分析，探究HATT和HXTT在铜表面的自组装机理。结果表明：HATT和HXTT在铜表面的自组装单层膜都能很好地延缓铜的腐蚀。铜表面经5×10-5 mol/L HATT和HXTT处理24 h，后所生成的自组装膜对铜在0.5 mol/L盐酸溶液中的缓蚀效率分别达到97.33%(HATT)和95.51%(HXTT)，HATT的效果更佳。HATT和HXTT都通过其分子中的氮、硫原子与Cu原子结合生成Cu(I)络合物而化学吸附于铜金属表面，形成致密的自组装单层膜，阻隔溶液中Cl-等腐蚀粒子扩散至铜表面，起到缓蚀作用。与此同时，自组装膜中烷基朝外面向溶液，使铜表面由亲水性转化成疏水性。
关键字: 己基三唑硫酮；自组装单层膜；交流阻抗；Tafel曲线；循环伏安；铜防腐
（School of Chemistry and Chemical Engineering, Central South University, Changsha 410083, China）
Abstract:The electrochemical properties of the self-assembled monolayer(SAM) of 3-hexyl-4-amino-1,2,4-triazole- 5-thione (HATT) or 5-hexyl-1,2,4-triazole-3-thione (HXTT) on copper surfaces were investigated by electrochemical impedance spectroscopy (EIS), Tafel polarization curve and cyclic voltammetry (CV). The results show that the SAM of HATT or HXTT exhibits the excellent resistance to copper corrosion. And the SAM formed on copper surfaces by 5×10-5 mol/L HATT or HXTT treatment of 24 h reaches corrosion inhibition efficiency of 97.33% or 95.51% to copper in 0.5 mol/L hydrochloric acid solution, respectively. The self-assembly mechanism of HATT or HXTT on copper surfaces was further evaluated by contact angle, adsorption thermodynamics and X-ray photoelectron spectra. The result indicates that HATT and HXTT chemisorbed on copper surfaces through bonding their N and S atoms with surface copper atoms to generate Cu(I) complexes. The closely arranged SAM might obstruct the corrosion particles, such as Cl- ions to diffuse to copper surfaces, resulting in corrosion inhibition. Moreover, the alkyl of the SAM faces to aqueous solutions to convert copper surfaces from hydrophilicity to hydrophobicity.
Key words: hexyl triazole-thione; self-assembled monolayer(SAM); electrochemical impedance spectroscopy (EIS); Tafel polarization curve; cyclic voltammetry (CV); copper corrosion inhibition
