(1. 重庆大学 材料科学与工程学院，重庆 400044；
2. 重庆大学 机械传动国家重点实验室，重庆 400044)
摘 要: 利用热处理工艺模拟实际服役工况，通过扫描电镜(SEM)、EBSD和XRD分析铜/铝复合板经不同热处理温度和时间后，结合界面处金属间化合物(IMCs)的组成、结构和生长规律，建立生长模型，并测定铜/铝复合板的热扩散系数，研究铜/铝复合板界面组织结构特征与导热性能之间的关系。结果表明：IMCs层厚度随热处理温度和时间的增加而增加；热处理温度超过500 ℃时，界面层出现Al4Cu9、AlCu、Al2Cu3和Al2Cu 4种IMCs；界面IMCs厚度与时间呈幂函数关系，各层生长速率与温度之间满足Arrhenius关系；随着IMCs厚度的增加，铜/铝复合板的热扩散系数下降，导热性能下降。同时，研究结果为优化铜/铝复合板制备工艺和建立应用准则提供理论基础和科学依据。
关键字: 铜铝复合板；界面扩散；金属间化合物；导热性
（1. College of Materials Science and Engineering, Chongqing University, Chongqing 400044, China;
2. State Key Laboratory of Mechanical Transmissions, Chongqing University, Chongqing 400044, China）
Abstract:The actual service conditions were simulated by different heat treatment processes. The interfacial intermetallic compounds (IMCs) component, structure and growth law were investigated by scanning electron microscopy (SEM), EBSD and X-Ray diffraction, and the growth model was established. The thermal diffusivity α was measured and the relationship between interfacial structure characteristics and thermal conductivity of Cu/Al composite sheet was studied. The results indicate that the IMCs are Al4Cu9, AlCu, Al2Cu3 and Al2Cu during above 500 ℃ treatment. The interfacial layer width increases with the increase of the hot treatment temperature and time. The interfacial thickness and annealing time follow the power function relation, the growth rates of the intermetallic phase layers and annealing temperature comply with the Arrhenius relation. With the total thickness of the interfacial IMCs increasing during annealing, the thermal diffusivity of Cu/Al composite decreases. The results provide the theoretical and scientific basis for the optimizing of the preparation process of Cu/Al composite sheet and establishing the application criteria.
Key words: Cu/Al clad sheets; interfacial diffusion; intermetallic compounds (IMCs); thermal conductivity
