中国有色金属学报(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 29 No. 3 March 2019 |
（1. Institute of Materials Processing and Intelligent Manufacturing,
College of Materials Science and Chemical Engineering, Harbin Engineering University, Harbin 150001, China;
2. Department of Materials Science and Engineering, College of Engineering, Peking University, Beijing 100871, China）
Abstract:The microstructure, mechanical properties and electrical conductivity of the room-temperature and cryogenically rolled Cu-0.2wt.%Mg alloy were investigated by transmission electron microscopy (TEM), electron backscattered diffraction (EBSD), hardness measurement, tensile tests and electrical conductivity measurement. The results show that for the cryorolled sample, the grain size is decreased by 41% compared with the sample processed at room temperature. With increasing thickness reduction, the microhardness of the alloy continuously increases and the electrical conductivity decreases. For the sample with 90% thickness reduction rolled at cryogenic temperature, the tensile strength and the electrical conductivity are 726 MPa and 74.5% IACS, respectively. The improved tensile strength can be mainly attributed to the grain boundaries strengthening and dislocation strengthening.
Key words: CuMg alloy; cryorolling; mechanical properties; grain size; twin
