Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第28卷    第12期    总第237期    2018年12月

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文章编号:1004-0609(2018)-12-2558-10
NH3-NH4Cl-H2O体系低品位硫化铜矿氧化浸出-脉冲电积工艺
李树超,杨建广,陈 冰, 丁 龙,南天翔

(中南大学 冶金与环境学院,长沙 410083)

摘 要: 采用单因素试验法,研究某低品位硫化铜精矿(Cu 7.42%(质量分数))在NH3-NH4Cl-H2O体系中的氧化浸出行为。结果表明:在液固比 4:1、[NH3·H2O]=1 mol/L、[NH4Cl]=3 mol/L、氧化剂过量系数1.4、原料粒度94~124 μm、浸出时间2 h、温度30℃的条件下,该低品位硫化铜矿浸出率98.89%;并在此基础上开展了从该低品位硫化铜精矿铜氨浸出液中直接脉冲电积铜的工艺优化试验。结果表明:在[NH4Cl]=3 mol/L、[NH3·H2O]=1.5 mol/L、[Cu2+]=20 g/L、明胶0.06 g/L、硫脲0.05 g/L、脉冲电流密度600 A/m2、占空比90%的条件下,可以获得平整光滑且有金属光泽的阴极铜,阴极电流效率87.97%。阴极铜XRD分析结果表明:氨-氯化铵体系中脉冲电积铜晶体主要沿(220)晶面生长,其余晶面未见明显反射峰,表现出类单晶结构。SEM分析显示:该阴极铜表面光滑致密且无瘤状物产生,铜在阴极表面的生长方式呈与阴极面垂直的一维方向生长。

 

关键字: 低品位硫化铜精矿;氨性氧化浸出;脉冲电积

Oxidation leaching and pulse electro-deposition of low-grade copper sulfide ore in NH3-NH4Cl-H2O system
LI Shu-chao, YANG Jian-guang, CHEN Bing, Ding Long, Nan Tian-xiang

School of Metallurgy and Environmental, Central South University, Changsha 410083, China

Abstract:The oxidative leaching behaviors of a low grade copper sulfide concentrate in NH3-NH4Cl-H2O were investigated by using single-factor experiment method. The results show that 98.89% copper can be leached under the conditions of liquid-solid ratio 4:1, NH3·H2O concentration 1.0 mol/L, ammonium chloride concentration 3.0 mol/L, 1.4 times stoichiometric oxidant dosage, particle size 94-124 μm, contact time 2 h and temperature 30℃. In addition, the optimization experiments of direct pulse copper electro-deposition from this cuprammonia leach solution were carried out. A flat and metallic luster cathode copper plate with cathode current efficiency 87.97% is obtained under the optimized conditions NH4Cl concentration 3 mol/L, NH3·H2O concentration 1.5 mol/L, Cu2+ concentration 20 g/L, gelatin concentration 0.05 g/L, thiourea concentration 0.06 g/L, pulse current density 600 A/m2 and duty cycle 90%. XRD analysis results of the resultant cathode copper show that the copper crystal in the ammonia system grow mainly along (220) crystal surface, and there is no obvious reflection peak on the other crystal faces, which show that the cathode copper is analogous to single crystal structure. SEM analysis results show that the surface of the cathode copper is smooth, compact and without tumor on the surface. The growth of copper on the cathode surface is in one-dimensional direction perpendicular to the cathode surface.

 

Key words: low grade copper sulfide concentrate; oxidative ammonia leaching; pulse electrodeposition

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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