Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第28卷    第12期    总第237期    2018年12月

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文章编号:1004-0609(2018)-12-2523-08
SiC颗粒级配对SiCp/Al复合材料微观结构和性能的影响
王武杰1,洪 雨2,刘家琴1, 3, 4,吴玉程1, 2, 3, 4

(1. 合肥工业大学 工业与装备技术研究院,合肥 230009;
2. 合肥工业大学 材料科学与工程学院,合肥 230009;
3. 有色金属与加工技术国家地方联合工程研究中心,合肥 230009;
4. 安徽省有色金属材料与加工工程实验室,合肥 230009
)

摘 要: 采用放电等离子烧结技术制备高体积分数SiCp/Al复合材料,研究SiC颗粒级配对复合材料微观结构、热和力学性能的影响。结果表明:放电等离子烧结制备的SiCp/Al复合材料由SiC和Al两相组成,SiC颗粒基本呈均匀随机分布、层次明显,SiC颗粒与Al基体界面结合强度高且无Al4C3等脆性相生成。在双粒径级配的SiCp/Al复合材料中,SiC体积分数从50%增加到65%时,其相对密度从99.93%下降到96.40%;其中,当SiC体积分数为60%时,复合材料的相对密度、热导率、平均热膨胀系数(50~400 ℃)和抗弯强度分别为99.19%、227.5 W/(m·K)、9.77×10-6 K-1和364.7 MPa。

 

关键词: SiCp/Al复合材料;放电等离子烧结;颗粒级配;热导率;热膨胀系数;抗弯强度

Effect of SiC grain gradation on microstructure and performance of SiCp/Al composite
WANG Wu-jie1, HONG Yu2, LIU Jia-qin1, 3, 4, WU Yu-cheng1, 2, 3, 4

1. Institute of Industry & Equipment Technology, Hefei University of Technology, Hefei 230009, China;
2. School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China;
3. National-Local Joint Engineering Research Centre of Nonferrous Metals and Processing Technology, Hefei 230009, China;
4. Laboratory of Nonferrous Metal Material and Processing Engineering of Anhui Province, Hefei 230009, China

Abstract:SiCp/Al composite with high volume fraction of SiC was fabricated by spark plasma sintering. The effects of SiC grain gradation on the microstructure, thermal performance and mechanical properties of composite were investigated. The results show that the SiCp/Al composites are composed of SiC and Al, no reaction product such as Al4C3 fragility phase produces at the interface, and the SiC particles with two sizes distribute uniformly and randomly. The relative density of the composites containing bimodal SiC particles decreases from 99.93% to 96.4% with increasing the volume fraction of SiC from 50% to 65%. Relative density, thermal conductivity, average thermal expansion coefficient (50-400 ℃), and the bending strength of the composite containing 60% bimodal SiC particles are 99.19%, 227.5 W/(m·K), 9.77×10-6 K-1 and 364.7 MPa, respectively.

 

Key words: SiCp/Al composites; spark plasma sintering; grain gradation; thermal conductivity; thermal expansion coefficient; bending strength

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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