(1. 南京航空航天大学 材料科学与技术学院,南京 211106;
2. 郑州机械研究所新型钎焊材料与技术国家重点实验室,郑州450002)
摘 要: 随着无铅钎料性能的提升和人们环保意识的提高,无铅钎料也逐渐被应用在特殊环境中。介绍特殊环境用无铅钎料可靠性的研究进展及趋势,分析特殊环境中无铅钎料焊点失效的原因,探讨各种特殊环境中提高无铅钎料可靠性的方法和机理,如微合金化、颗粒强化和基板改善,总结目前无铅钎料可靠性研究存在的不足,对无铅钎料未来的研究方向提出建议。
关键字: 特殊环境;无铅钎料;微合金化;颗粒强化;基板改善;可靠性
(1. College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 211106,China;
2. State Key Laboratory of Advanced Brazing Filler Metals and Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou450002, China)
Abstract:Lead-free solders are applied under special conditions with the improvement of property of the solders and people''''s awareness of environmental protection. The research status and development trend of lead-free solders used under special conditions were reviewed synthetically. First of all, the failure mechanism of solder joints under different special conditions was discussed. Moreover, the ways to enhance the reliability of lead-free solders under several special conditions were reported and analyzed, such as microalloying, particle strength and substrate improvement. In addition, the defects of the current reliability research of lead-free solders were summarized, and the further research was prospected.
Key words: special condition; lead-free solder; microalloying; particle strength; substrate improvement; reliability