Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报(英文版)

Transactions of Nonferrous Metals Society of China

Vol. 28    No. 4    April 2018

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Direct active soldering of Al0.3CrFe1.5MnNi0.5 high entropy alloy to 6061-Al using Sn-Ag-Ti active solder
L. C. TSAO1, S. Y. CHANG2, Y. C. YU1

1. Department of Materials Engineering, National Pingtung University of Science & Technology, Neipu, Pingtung 91201, China; 2. Department of Mechanical Engineering, National Yunlin University of Science & Technology, Touliu, Yunlin 64002, China

Abstract:Al0.3CrFe1.5MnNi0.5 high entropy alloys (HEA) have special properties. The microstructures and shear strengths of HEA/HEA and HEA/6061-Al joints were determined after direct active soldering (DAS) in air with Sn3.5Ag4Ti active filler at 250 °C for 60 s. The results showed that the diffusion of all alloying elements of the HEA alloy was sluggish in the joint area. The joint strengths of HEA/HEA and HEA/6061-Al samples, as analyzed by shear testing, were (14.20±1.63) and (15.70±1.35) MPa, respectively. Observation of the fracture section showed that the HEA/6061-Al soldered joints presented obvious semi-brittle fracture characteristics.

 

Key words: high entropy alloy; Sn3.5Ag4Ti active filler; Al0.3CrFe1.5MnNi0.5; direct active soldering

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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