Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第27卷    第12期    总第225期    2017年12月

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文章编号:1004-0609(2017)-12-2493-08
粉末冶金制备50%SiCp/Al复合材料的结构及性能
茅学志1,洪 雨2,张玉君3,冯 东3,杨 磊3,史常东3,吴玉程4,汤文明1, 4

(1. 合肥工业大学 材料科学与工程学院,合肥 230009; 2. 合肥工业大学 分析测试中心,合肥 230009; 3. 中国电子科技集团公司 第43研究所,合肥 230088; 4. 合肥工业大学 安徽省功能材料与器件重点实验室,合肥 230009)

摘 要: 采用球磨加常压烧结的粉末冶金工艺制备50%SiCp/6061Al(体积分数)复合材料,研究了烧结温度对该高体积分数SiCp/Al复合材料结构与性能的影响。结果表明:球磨有利于形成成分均匀的50% SiCp6061Al复合粉体;随着烧结温度的升高,50%SiCp/6061Al复合材料的致密度及抗弯强度先增后减。710 ℃烧结的复合材料性能最佳,致密度达到97%,抗弯强度大于400 MPa。该复合材料中SiCp呈解理断裂,而Al合金基体呈韧性撕裂的断裂特征。750 ℃烧结的50%SiCp/6061Al复合材料中,SiCp/Al界面反应加剧,生成较多的Al4C3相,导致复合材料结构劣化,性能降低。

 

关键字: SiCp/Al复合材料;粉末冶金;烧结温度;显微组织;力学性能

Microstructures and properties of 50%SiCp/Al composites fabricated by powder metallurgy
MAO Xue-zhi1, HONG Yu2, ZHANG Yu-jun3, FENG Dong3, YANG Lei3, SHI Chang-dong3, WU Yu-cheng4, TANG Wen-ming1, 4

1. School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China; 2. Analysis and Test Center, Hefei University of Technology, Hefei 230009, China; 3. 43 Institute, China Electronics Technology Group Corporation, Hefei 230088, China; 4. Key Laboratory of Functional Materials and Devices of Anhui Province, Hefei University of Technology, Hefei 230009, China

Abstract:50%SiCp/6061Al (volume fraction) composites were fabricated using powder metallurgy technique via ball-milling and pressureless sintering. The effect of sintering temperature on microstructures and properties of the SiCp/Al composites with high SiCp volume fraction was especially stressed. The results show that ball milling is beneficial to the uniform composition distribution of the 50%SiCp/6061Al composites powder. With increasing the sintering temperature, the density and bending strength of the 50%SiCp/Al composites increase initially and then decrease. The SiCp/Al composite sintered at 710 ℃ has the optimal properties, i.e. the relative density is 97% and the bending strength is above 400 MPa. The SiC particles and Al alloy matrix in the composite follow the cleavage and plastic tearing fracture modes, respectively. As the sintering temperature increases to 750 ℃, an intensive SiCp/Al interfacial reaction takes place to form more Al4C3 phase, resulting in the structural degradation and property reduction of the SiCp/Al composite.

 

Key words: SiCp/Al composite; powder metallurgy; sintering temperature; microstructure; mechanical property

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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