(1. 北京科技大学 材料科学与工程学院，北京 100083； 2. 北京科技大学 新兴产业技术研究院，北京 100083)
摘 要: 采用高性价比液固分离法(LSS)制备高性能金刚石/铝散热基板，研究金刚石镀铜对复合材料界面结合和导热性能的影响，利用SEM、EMPA、XRD分析复合材料的断口形貌及界面行为。结果表明：镀层元素向基体扩散与基体铝形成Al2Cu4化合物，中间相增强两相界面结合，改善材料性能。金刚石镀铜处理后，复合材料致密度提高1.16%，热导率提高9.50%，抗拉强度提高17.39%，复合材料的热物理性能优于CE13合金的。用Maxwell、Kerner理论模拟预测热导率(TC)、热膨胀系数(CTE)与实际测量结果相一致。
关键字: 金刚石/铝复合材料；液固分离法；镀层；热导率；热膨胀系数；电子封装
（1. School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China; 2. Institute of Emerging Technology and Industry, University of Science and Technology Beijing, Beijing 100083, China）
Abstract:High performance diamond/Al composites for heat dissipation were manufactured by advanced cost-effective liquid-solid separation (LSS) technology. The effect of Cu coating on the interface bonding and thermal conductivity of composite materials were researched. The fracture morphology and interfacial behavior of composite materials were analyzed by SEM, EMPA and XRD. The result show that the Al2Cu4 compounds form from coating element diffuse and Al matrix, which can enhance the interfacial bonding between the two phases and improve the properties of the materials. After Cu coating, the density of the composites increases by 1.16%, the thermal conductivity increases by 9.50%, the tensile strength increases by 17.39%. The thermal physical properties of Cu-diamond/Al are better than that of CE13 (controlled expansion) alloy. Additionally, the experimental data of thermal conductivity and coefficient of thermal expansion of diamond/Al composites show the similar tendency with those by Maxwell and Kerner models, respectively.
Key words: diamond/Al composites; liquid-solid separation technology; coating; thermal conductivity; coefficient of thermal expansion; electronic packaging
