Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第27卷    第3期    总第216期    2017年3月

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文章编号:1004-0609(2017)-03-0477-09
表面纳米化对铜镁合金电化学腐蚀行为的影响
关晓楠1,江静华1,陈建清1,马爱斌1,宋 丹1,李学斌2

(1. 河海大学 力学与材料学院,南京 211100;
2. 中铁建电气化局集团 康远新材料有限公司,江阴 214521
)

摘 要: 为获得高强高导耐蚀铜合金接触线,以Conform态细晶铜镁合金(Cu-0.4%Mg(质量分数))为对象,研究高速旋转丝表面纳米化对其耐蚀性的影响。利用光学显微镜(OM)、透射电镜(TEM)、扫描电镜(SEM)分析试样的显微组织,并借助电化学工作站研究其电化学腐蚀行为。结果表明:伴随位错胞及孪晶的形成,铜镁合金表层晶粒细化至400 nm;表面纳米化后铜镁合金在NaOH溶液中会出现明显的活化-钝化-过钝化过程,其耐蚀性有所改善,腐蚀电流密度Jcorr由5.347×10-5 A/cm2减小至1.365×10-5 A/cm2,自腐蚀电位φcorr由-0.470 V提高至-0.415 V。此外,提高OH浓度会加剧腐蚀,但延长浸泡时间有利于钝化膜的形成,降低腐蚀速率。

 

关键字: 铜镁合金;接触线;表面纳米化;电化学腐蚀

Effect of surface nanocrystallization on electrochemical corrosion behaviours of Cu-Mg alloy
GUAN Xiao-nan1, JIANG Jing-hua1, CHEN Jian-qing1, MA Ai-bin1, SONG Dan1, LI Xue-bin2

1. College of Mechanics and Materials, Hohai University, Nanjing 211100, China;
2. Kang Yuan New Materials Co., Ltd., China Railway Construction Electrification Bureau Group, Jiangyin 214521, China

Abstract:The electrochemical corrosion behaviours of a Conform-extruded Cu-0.4%Mg (mass fraction) alloy after surface nano-crystallization (SNC) via a high-speed rotating wire-brushing were evaluated to develop the high-strength and high conductivity anti-corrosive copper alloy for high-speed railway contact wires. The microstructures of the samples were analyzed by OM, TEM and SEM, and their electrochemical corrosion behaviors were tested by an electrochemical workstation. The results indicate that the SNC-treated surface presented obvious plastic deformation flow traces with dislocation cells and twins. The grain size of the deformed zone is about 400 nm, presenting typical nano-crystalline characteristic. The SNC-treated alloy presents the typical corrosion period of active, passive and transpassive in NaOH solution. SNC improves the corrosion resistance of the Cu-Mg alloy, the corrosion current density (Jcorr) decreases from 5.347×10-5 A/cm2 to 1.365×10-5 A/cm2, and the corrosion potential (φcorr) increases from -0.470 V to -0.415 V. In addition, the rate of corrosion increases in higher concentration of OH, whereas decreases with the extension of soaking time due to the formation of the passive film.

 

Key words: Cu-Mg alloy; contact wires; surface nanocrystallization; electrochemical corrosion

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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