Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报(英文版)

Transactions of Nonferrous Metals Society of China

Vol. 26    No. 10    October 2016

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Microstructures and properties of Al-50%SiC composites for electronic packaging applications
Fei TENG1,2, Kun YU1,2, Jie LUO1, Hong-jie FANG1, Chun-li SHI1, Yi-long DAI2, Han-qing XIONG2

1. Department of Materials Science and Engineering, Yantai Nanshan University, Yantai 265713, China;
2. School of Materials Science and Engineering, Central South University, Changsha 410083, China

Abstract:Al-50%SiC (volume fraction) composites containing different sizes of SiC particles (average sizes of 23, 38 and 75 μm) were prepared by powder metallurgy. The influences of SiC particle sizes and annealing on the properties of the composites were investigated. The results show that SiC particles are distributed uniformly in the Al matrix. The coarse SiC particles result in higher coefficient of thermal expansion (CTE) and higher thermal conductivity (TC), while fine SiC particles decrease CTE and improve flexural strength of the composites. The morphology and size of SiC particles in the composite are not influenced by the annealing treatment at 400 °C for 6 h. However, the CTE and the flexural strength of annealed composites are decreased slightly, and the TC is improved. The TC, CTE and flexural strength of the Al/SiC composite with average SiC particle size of 75 μm are 156 W/(m·K), 11.6×10-6 K-1 and 229 MPa, respectively.

 

Key words: Al-50%SiC composites; powder metallurgy; thermal properties; flexural strength; electronic packaging material

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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