中国有色金属学报(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 26 No. 9 September 2016 |
（1. School of Materials Science and Engineering,
Henan University of Science and Technology, Luoyang 471023, China;
2. Henan Collaborative Innovation Centre of Non-Ferrous Generic Technology,
Henan University of Science and Technology, Luoyang 471023, China;
3. Department of Mechanical Engineering, University of South Florida, Tampa FL 33620, USA）
Abstract:Cu films on Fe, Ni and Ag substrates, Ni films on Fe and Ag substrates, Ag film on Cu substrate, Cr film on Fe substrate, Ag film on Ag substrate, Ni film on Ni substrate and Cu film on Cu substrate were deposited by electroplating. The average internal stress in all films, except Cr, was in-situ measured by the cantilever beam test. The interfacial stress is very large in the films with different materials with substrates and is zero in the films with the same material with substrates. The interfacial stress character obtained from the cantilever beam bending direction is consistent with that obtained from the modified Thomas–Fermi–Dirac electron theory.
Key words: metal film; deposition; interface; internal stress; electron density
