Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第26卷    第2期    总第203期    2016年2月

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文章编号:1004-0609(2016)02-0328-09
铜基粉末冶金摩擦材料特征摩擦组元与基体的界面形成及磨损机理
周海滨,姚萍屏,肖叶龙,张忠义,贡太敏,赵林,邓敏文,钟爱文,王奇

(中南大学粉末冶金国家重点实验室,长沙 410083)

摘 要: 从界面角度出发,研究铜基粉末冶金摩擦材料中不同特征摩擦组元与基体组元形成的界面,并深层次探讨界面与摩擦表面、亚表面结构、摩擦磨损性能及磨损机理之间的关系。结果表明:SiC分别与基体Cu和Fe形成结合较差的机械结合界面和反应结合界面,高碳铬铁(HCC)与基体Cu形成扩散-机械结合界面;SiC与HCC均与基体形成含缺陷界面,而裂纹易沿界面缺陷形核扩展,使材料发生剥层磨损,促进机械混合层(MML)形成。而SiO2与铜基体形成紧密机械结合界面,使得材料表层SiO2受摩擦力及正压力的反复作用发生破碎剥落,从而导致严重犁削磨损。

 

关键字: 界面;摩擦组元;摩擦材料;粉末冶金;机理

Interface formation and wear mechanism between characteristic friction components and base components of Cu-based powder metallurgy friction materials
ZHOU Hai-bin, YAO Ping-ping, XIAO Ye-long, ZHANG Zhong-yi, GONG Tai-min, ZHAO Lin, DENG Min-wen, ZHONG Ai-wen, WANG Qi

State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, China

Abstract:From the view of interface, the effects of interface formed between friction components and Cu matrix on friction and wear mechanism and the relationships among the microstructure of friction surface or sub-surface, friction and wear mechanism of copper matrix composite prepared by powder metallurgy method were investigated. The results show that the reaction bonding interface and mechanical bonding interface form between SiC/Cu and SiC/Fe matrix interface, respectively. The mechanical-diffuse bonding interface forms between high-carbon chromite(HCC) and Cu matrix. The defect of both interfaces lends to the development of crack which takes responsibility for occurrence of delamination and promotes the formation of the mechanical mixed layer(MML). The complete mechanical bonding interface forms between SiO2/Cu matrix. However, fragile SiO2 broken by repeated pressure is the main reason that the severe plough appears on the friction surface.

 

Key words: interface; friction component; friction material; powder metallurgy; wear mechanism

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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