(中南大学材料科学与工程学院，长沙 410083)
摘 要: 采用复合电镀技术，在酸性硫酸盐镀铜电镀液中加入粒径为20 μm的金刚石粉体制备Cu-金刚石复合镀层。通过正交试验优化Cu-金刚石复合电镀的工艺参数，采用扫描电镜(SEM)、能谱仪(EDS)和显微硬度计研究CuSO4·5H2O浓度、阴极电流密度、金刚石粉体浓度和镀液温度对镀层质量的影响。采用X射线分析仪(XRD)、扫描电镜(SEM)和摩擦实验机表征优化后复合镀层的相结构、表面形貌及摩擦性能。结果表明：优化的镀液组成和工艺参数为CuSO4·5H2O 190 g/L，H2SO4 60 g/L，阴极电流密度10 A/dm2，金刚石粉体浓度20 g/L，镀液温度20 ℃；优化后的复合镀层晶粒均匀，金刚石粉体质量分数为21.50%，具有较好的显微硬度和摩擦性能。
关键字: 复合电沉积；硫酸铜；浓度；阴极电流密度；金刚石粉体；Cu-金刚石；复合镀层；摩擦性能
（School of Materials Science and Engineering, Central South University, Changsha 410083, China）
Abstract:The Cu-diamond composite coating was prepared by composite electroplating when diamond particles with diameter of 20 μm were put into acidic sulfate copper plating solution. The optimized technological conditions of Cu-diamond composite electroplating were obtained by orthogonal test. The effects of CuSO4·5H2O concentration, cathode current density, diamond concentration and temperature on the quality of Cu-diamond composite coatings were investigated by SEM, EDS and microhardness tester. The phase structure, surface morphology and tribological properties were investigated by XRD, SEM and friction-abrasion testing machine. The results show that the optimized technological conditions are CuSO4·5H2O 190 g/L, H2SO4 60 g/L; cathode current density, 10A/dm2; diamond concentration, 20 g/L; temperature, 20 ℃. The Cu-diamond composite coating containing 21.50% diamond particles has homogeneous grains, better microhardness and tribological performance.
Key words: composite electroplating; CuSO4·5H2O; concentration; cathode current density; diamond powder; Cu-diamond; composite coating; tribological performance
