(1. 河北工程大学机电工程学院，邯郸 056038；
2. 北京科技大学材料科学与工程学院，北京100083)
摘 要: 为了提高铜铝复合材料的冶金结合质量，根据铜铝在共晶温度548 ℃到铝熔点温度660 ℃范围内的液相扩散结合机理，建立相应温度范围内的铜铝等温反应扩散数学模型，并对模型进行求解。计算结果表明：由于铜铝相互扩散，首先在界面形成铜固溶体(α)和铝固溶体(γ)，随后铜铝界面发生液化并形成液相扩散层(L)和金属间化合物层(IMC)；随着加热时间延长，固液界面IMC/L和γ/L分别向α侧和γ侧迁移，界面迁移距离与加热时间呈抛物线关系，抛物线系数与温度有关，温度越高，系数越大。
关键字: 铜/铝；数学模型；动力学；液相扩散结合
（1. School of Mechanical and Electrical Engineering, Hebei University of Engineering, Handan 056038, China;
2. School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China）
Abstract:In order to improve the metallurgical bonding in Cu/Al composites, the mathematical model of isothermal reactive diffusion between Cu and Al in the temperature range between eutectic temperature 548 ℃ and aluminum melting point of 660 ℃ was established and solved based on the liquid phase diffusion bonding mechanism. The analytical results show that the copper solid solution (α) and the aluminum solid solution (γ) form firstly owing to the interdiffusion between Cu and Al, then the liquid phase diffusion layer (L) and intermetallic compound (IMC) generate and the bonding boundary liquates. The IMC/L and γ/L solid-liquid interface migrate towards the solid solution phase α and the solid solution phase γ, respectively. Furthermore, there exists the parabolic relationship between the interface migration distance and the annealingtime, the parabolic coefficients depend on the temperature, the higher the temperature, the bigger the coefficients.
Key words: copper/aluminum; mathematical model; kinetics; liquid phase diffusion bonding
