(1. 山东大学 材料科学与工程学院，济南 250061；
2. 济南宝世达实业发展有限公司，济南 250061)
摘 要: 利用光学显微镜和X射线衍射仪表征TAg0.1铜银合金的显微组织，采用显微硬度计、电子万能试验机、电导率测量仪等设备研究TAg0.1合金的力学性能及电学性能，系统分析铜银合金导线成型工艺过程中挤压、拉拔及退火等工序对TAg0.1合金显微组织、力学性能和电学性能的影响。结果表明：拉拔处理后TAg0.1合金的强度和硬度较挤压态提高，但伸长率和电导率降低。经退火处理后，TAg0.1合金的强度和硬度值均减小，伸长率和电导率均增大。经挤压、拉拔、中间退火、拉拔的工艺后，获得的TAg0.1空心导线硬度值为129.7 HV0.05、抗拉强度为400 MPa、导电率为99.5% IACS。
关键字: 铜银合金；显微组织；力学性能；电学性能
（1. School of Material Science and Engineering, Shandong University, Jinan 250061, China;
2. Jinan Baoshida Industrial Development Co., Ltd, Jinan 250061, China）
Abstract:The microstructures of TAg0.1 alloys were characterized by optical microscopy and X-ray diffraction. The mechanical and electrical properties of TAg0.1 alloys were studied by microhardness tester, electronic universal testing machine and conductivity indicator. The influence of producing procedures, such as extraction, drawing and annealing, on the microstructure, mechanical properties and electrical properties of TAg0.1 alloys in the molding process of Cu-Ag alloy wire was analyzed systematically. The results indicate that the strength and hardness of TAg0.1 alloys increase after the drawing process, while the elongation and conductivity decrease. The elongation and conductivity of TAg0.1 alloys increase after annealing process, while the strength and hardness decrease. The TAg0.1 alloys were gotten after extraction, drawing, annealing and drawing processes. The hardness of TAg0.1 alloys is 129.7 HV0.05, the tensile strength is 400 MPa, and the electrical conductivity is 99.5% IACS.
Key words: Cu-Ag alloy; microstructure; mechanical property; electrical property
