(中南大学 粉末冶金国家重点实验室，长沙 410083)
摘 要: 以仲钼酸铵为反应物，采用熔盐法在低密度C/C复合材料孔隙表面制备Mo2C涂层，改善Cu与C/C坯体的润湿性，然后通过无压熔渗Cu制备C/C-Cu复合材料，研究了Mo2C改性层制备温度对Mo2C涂层和C/C-Cu复合材料组织结构及性能的影响。结果表明：Mo2C涂层在坯体内部孔隙表面分布均匀，且与炭基体和Cu均有良好的界面结合。在950~1150 ℃范围内，随涂层反应温度的提高，Mo2C层厚度由2.0 μm逐渐增大到6.5 μm，C/C-Cu复合材料的密度逐渐增大，电阻率逐渐降低；抗弯强度呈现先增大后减小趋势，在涂层反应温度为1000 ℃时呈现最大值251.83 MPa。复合材料的摩擦因数均随磨损时间延长先增大后减小并趋于稳定。随着Mo2C涂层制备温度的提高，复合材料的摩擦因数逐渐增大，体积磨损率先减小后增加，在Mo2C涂层反应温度为1000 ℃时，复合材料的磨损率最低。
关键字: Mo2C涂层；C/C-Cu复合材料；熔渗；摩擦性能
（State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, China）
Abstract:In order to improve the wetting ability between molten copper and C/C preform, Mo2C interlayer was fabricated on the internal surface of C/C preform via molten salt deposition using ammonium paramolybdate as reactant. Then, C/C-Cu composites were prepared by pressureless infiltration. The influences of preparation temperature of Mo2C interlayer on the microstructure and properties of Mo2C interlayer and C/C-Cu composite were investigated. The results show that the Mo2C interlayer covered internal pore surface of the C/C preform uniformly has a good interface bonding with C/C substrate and Cu. With the increase of preparation temperature in the range of 950-1150 ℃, the thickness of the Mo2C interlayer increases from 2.0 μm to 6.5 μm, the density of C/C-Cu composite increases, the electrical resistivity decreases, the flexural strength firstly increases and then decreases, and reaches the maximum value (251.83 MPa) at 1000 ℃. The friction coefficient of the C/C-Cu composite firstly increases and then decreases to a stable value with friction time increasing. With the increase of the reaction temperature, the friction coefficient increases, the volume abrasion rate firstly decreases and then increases, and reaches the minimum value at 1000 ℃.
Key words: Mo2C interlayer; C/C-Cu composite; infiltration; tribological property
