中国有色金属学报(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 25 No. 3 March 2015 |
（1. Department of Materials Engineering, Tehran Science and Research Branch,
Islamic Azad University, Tehran 50122, Iran;
2. School of Metallurgy and Materials Engineering, University of Tehran, Tehran 50122, Iran）
Abstract:Transient liquid phase bonding of two dissimilar alloys Al 2024 and Ti-6Al-4V using Cu-22%Zn interlayer was carried out at 510 °C under vacuum of 0.01 Pa for various bonding time. In order to characterize the microstructure evolution in the joint zone, scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD) were applied. The results show that joint formation is attributed to the solid-state diffusion of Cu and Zn into Ti-6Al-4V and Al 2024 alloys followed by eutectic formation and isothermal solidification along the Cu-Zn/Al 2024 interface. The hardness of the joints at the interface increases with an increase in bonding time which can be attributed to formation of intermetallic compounds such as Al2Cu, TiCu3, Al4.2Cu3.2Zn0.7, Al0.71Zn0.29, Ti2Cu, TiAl3 and TiZn16 in the joint zone. Moreover, shear strength of the joint reaches the highest value of 37 MPa at bonding time of 60 min.
Key words: aluminum alloy; transient liquid phase bonding; homogenization; diffusion; intermetallic compound; eutectic
