(东北大学 材料与冶金学院，沈阳 110819)
摘 要: 基于田口方法，提出微波浸出铜阳极泥的优化方法，并对铜、碲、硒的浸出率进行信噪比分析。结果表明，固液比对铜、碲、硒浸出率的贡献率最大，贡献率分别达到60.83%、54.76%和62.05%。固液比是铜阳极泥微波浸出过程最重要的工艺参数，时间对于铜、碲浸出率为较重要因素，酸浓度对于硒浸出率为较重要因素，微波功率对于铜、碲、硒浸出率的贡献率都较小，分别为4.23%、12.37%和10.32%。铜浸出最优条件如下：微波功率450 W、时间5 min、固液比0.10 g/mL、酸浓度1.0 mol/L；碲、硒浸出最优条件如下：微波功率700 W、时间9 min、固液比0.10 g/mL、酸浓度1.0 mol/L。在优化后的工艺条件下进行验证实验，铜浸出率达到99.88%以上，碲浸出率达到95.70%以上，硒浸出率达到38.22%以上。
关键字: 铜阳极泥；田口法；微波；信噪比
（School of Materials and Metallurgy, Northeastern University, Shenyang 110819, China）
Abstract:An optimization method of microwave assisted leaching of copper anode slime was proposed based on Taguchi method for signal noise ratio (SNR) and variance analysis of the copper, tellurium and selenium leaching rates. The results shows that the solid-liquid ratio is the most important factor affecting SNR of the copper, tellurium and selenium leaching rates, and its contributions to the copper, tellurium and selenium leaching rates reach 60.83%, 54.76% and 62.05%, respectively. Solid-liquid ratio is a significant factor of the microwave leaching process of copper. Reaction time is a less significant factor of the leaching process of copper and tellurium and concentration of sulphuric acid is a less significant factor of the leaching process of selenium, while microwave power is an non-significant factor, its contributions to the copper, tellurium and selenium leaching efficiency reach 4.23%, 12.37% and 10.32%, respectively. The optimized parameters of the microwave assisted leaching of copper are as follows: microwave power 450 W, reaction period 5min, solid-liquid ratio 0.10 g/mL and concentration of sulphuric acid 1.0 mol/L. The optimized parameters of the microwave assisted leaching of tellurium and selenium are as follows: microwave power 700 W, reaction period 9min, solid-liquid ratio 0.10 g/mL and concentration of sulphuric acid 1.0 mol/L. The validation experiments under the optimized conditions was carried out, the leaching rates of copper, tellurium and selenium reach above 99.88%, 95.70% and 38.22%, respectively.
Key words: copper anode slime; Taguchi methods; microwave; signal noise ratio
