Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

您目前所在的位置:首页 - 期刊简介 - 详细页面

中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第24卷    第6期    总第183期    2014年6月

[PDF全文下载]        

    

文章编号:1004-0609(2014)06-1459-07
变形量对应变诱导熔化激活法制备CuSn10P1合金半固态组织的影响
王 佳1, 2,肖 寒1,吴龙彪1,卢德宏1,周荣锋1,周 荣1

(1. 昆明理工大学 材料科学与工程学院,昆明 650093;
2. 四川理工学院 机械工程学院,自贡 643000
)

摘 要: 采用锻造与重熔加热的应变诱导熔化激活(SIMA)法制备CuSn10P1合金半固态坯料,先对CuSn10P1铸锭进行退火处理,再对其进行锻造变形,然后对试样进行850及950 ℃保温5 min-水淬处理,获得CuSn10P1半固态坯料。采用金相显微镜和扫描电镜观察各阶段试样组织形貌,计算半固态组织的固相分数,分析变形量和重熔温度对CuSn10P1半固态组织的影响。结果表明:CuSn10P1合金铸锭经680 ℃、24 h退火后,消除了枝晶组织,获得了以α相为主的等轴晶组织。CuSn10P1合金半固态组织固相分数随变形量的增加而降低,当变形量从8.4%增加至21.9%经850 ℃重熔时,固相分数从70.15%降低至57.83%;950 ℃重熔时,固相分数从58.79%降低至53.10%。重熔温度越高,变形量对固相分数变化程度影响越小。

 

关键字: CuSn10P1合金;应变诱导熔化激活法;变形量;固相分数;微观组织

Effect of deformation on microstructure of semi-solid CuSn10P1 alloy fabricated by strain induced melt activation (SIMA) process
WANG Jia1, 2, XIAO Han1, WU Long-biao1, LU De-hong1, ZHOU Rong-feng1, ZHOU Rong1

1. Faculty of Materials Science and Engineering, Kunming University of Science and Technology,
Kunming 650093, China;
2. College of Mechanical Engineering, Sichuan University of Science and Engineering, Zigong 643000, China

Abstract:Semi-solid CuSn10P1 alloy billets were fabricated by strain induced melt activation (SIMA) method including the forging and remelting processes. Firstly, CuSn10P1 billets were annealed and forged. Secondly, the billets were reheated to 850℃ or 950℃, and hold for 5 min. Finally, the billets were water quenched, and semi-solid microstructures of CuSn10P1 alloy were obtained. The microstructures of semi-solid CuSn10P1 alloy with different stages were observed by OM and SEM. The solid fractions of the semi-solid microstructure were computed. The effects of deformation and remelting temperature on the microstructures of semi-solid CuSn10P1 alloy were investigated. The results indicate that dendritic structure of CuSn10P1 billets is eliminated, and equiaxed grains of α phase are obtained after annealing at 680 ℃ for 24 h. The solid fraction of semi-solid CuSn10P1 microstructure decreases with the increase of the deformation. With the increase of the deformation from 8.4% to 21.9%, the solid fraction decreases from 70.15% to 57.83% by remelting at 850 ℃, and the solid fraction decreases from 58.79% to 53.10% by remelting at 950 ℃. The higher the remelting temperature is, the smaller the effect of deformation on solid fraction is.

 

Key words: CuSn10P1 alloy; strain induced melt activation; deformation; solid fraction; microstructure

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

主管:中国科学技术协会 主办:中国有色金属学会 承办:中南大学
湘ICP备09001153号 版权所有:《中国有色金属学报》编辑部
------------------------------------------------------------------------------------------
地 址:湖南省长沙市岳麓山中南大学内 邮编:410083
电 话:0731-88876765,88877197,88830410   传真:0731-88877197   电子邮箱:f_ysxb@163.com