(北京有色金属研究总院 有研亿金新材料股份有限公司, 北京 102200)
摘 要: 对纯Ti/6061Al在3种温度条件下进行热等静压(HIP)扩散焊接实验，利用扫描电镜(SEM)、显微硬度测试及拉伸强度测试对Ti/6061Al 接头界面附近的显微组织及性能进行研究。结果表明，在530 ℃下，Ti/6061Al扩散焊接界面区域形成一定的扩散层，但未出现明显金属间化合物相，接头抗拉强度达120 MPa以上，具有较佳的组织与性能。同时，对HIP扩散焊接与传统的热压扩散焊接的对比分析表明，相对于热压扩散焊接，HIP作为一种先进的扩散焊接技术，能在较低温度下通过较高的焊接压力，实现铝与钛的高强度连接。
关键字: Ti/Al异种金属；扩散焊接；热等静压；拉伸强度
（Grikin Advanced Materials Co., Ltd., General Research Institute for Non-ferrous Metals, Beijing 102200, China）
Abstract:Dissimilar metals of pure Ti and 6061Al alloy were diffusion-bonded by hot isostatic pressing (HIP) process at three bonding temperatures. The microstructures and properties of Ti/6061Al HIP bonded joint were studied by SEM, micro-hardness test and tensile strength test. The results show that at the HIP temperature of 530 ℃, the joint has the best microstructure and mechanical properties. An intermediate diffusion layer without obvious intermetallics forms in the Ti/6061Al interface zone and the joint tensile strength is greater than 120 MPa HIPed at this temperature. The diffusion bonding mechanism was also discussed by comparing with conventional vacuum hot pressure diffusion bonding process. It is found that the high pressure at low temperature plays an important role for high strength bonding to HIP.
Key words: Ti/Al dissimilar metal; diffusion bonding; hot isostatic pressing; tensile strength
