中国有色金属学报(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 23 No. 12 December 2013 |
（1. School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China;
2. Division of Nano Metrology and Materials Measurement, National Institute of Metrology, Beijing 100013, China）
Abstract:The diffusion barrier Ni-Mo-P film for Cu interconnects was prepared on SiO2/Si substrate using electroless method. The surface morphology and composition during the formation process of electroless Ni-Mo-P film were investigated through analyzing samples of different deposition time. Induced nucleation, induced co-deposition, and self-induced growth mechanisms involved in electroless process were confirmed by field-emission scanning electron microscopy (FE-SEM), energy dispersive spectrometry and atomic force microscopy (AFM). Firstly, the preceding palladium particles as catalysts induce the nucleation of nickel. Secondly, the nickel particles induce the deposition of molybdenum and phosphorus, which attributes to induced co-deposition. Thirdly, former deposited Ni-Mo-P induces deposition of the latter Ni-Mo-P particles. Moreover, the reaction mechanism was proposed with the oxydate of .
Key words: Ni-Mo-P deposit; induced-deposition; electroless deposition; SiO2 substrate
