(1. 重庆理工大学 材料科学与工程学院，重庆 400054；
2. 重庆平伟科技(集团)有限公司，重庆 400026)
摘 要: 分别采用低温搅拌钎焊和润湿平衡法对Sn-Cu-Ag亚共晶钎料及其纳米复合钎料进行钎焊，并对其进行时效处理。结果发现：纳米Ni颗粒有利于金属间化合物(IMC)的形成，在钎焊界面形成孔洞状的(CuxNi1-x)6Sn5；采用低温搅拌钎焊工艺时，时效过程中两种接头的IMC厚度与时效时间 的拟合直线完全重合，纳米颗粒对IMC结构的改变作用不明显；采用润湿反应钎焊工艺，添加颗粒后钎料中元素互扩散系数降低一个数量级，纳米颗粒对时效过程中IMC的生长有明显的抑制作用。
关键字: 纳米颗粒；搅拌钎焊；IMC；润湿平衡；时效处理
（1. School of Materials Science and Engineering, Chongqing University of Technology, Chongqing 400054, China;
2. Chongqing Pingwei Technology (Group) Co., Ltd., Chongqing 400026, China）
Abstract:Soldering with Sn-Cu-Ag eutectic solder or its composite solder by low-temperature stirring soldering and wetting balance method were implemented respectively, and the aging treatments were performed. The results show that the nano-Ni particles are beneficial to the formation of IMC, and the hole shape (CuxNi1-x)6Sn5 forms in the soldering interface. With low-temperature soldering process, the fitting line of the IMC thickness and aging time is totally coincident in two soldering joint, and the structural change of the IMC due to adding nano-particles is not obvious. With the wetting balance test method, the mutual diffusion coefficient reduces by an order of magnitude after adding nanoparticles, the nano-Ni particles are beneficial to inhibiting the growth of IMC.
Key words: nanoparticle; stirring soldering; IMC; wetting balance; aging treatment
