Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第23卷    第10期    总第175期    2013年10月

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文章编号:1004-0609(2013)10-2875-07
纳米Ni颗粒增强无铅Sn-Cu-Ag复合钎料搅拌辅助低温钎焊技术
甘贵生1,杜长华1,许惠斌1,杨 滨2,李镇康1,王 涛1,黄文超1

(1. 重庆理工大学 材料科学与工程学院,重庆 400054;
2. 北京科技大学 新金属材料国家重点实验室,北京 100083
)

摘 要: 采用搅拌辅助低温(半固态区间)钎焊技术,制备低银无铅钎料和纳米复合钎料钎焊接头。结果表明:240 ℃时复合钎料的润湿时间较基体的润湿时间缩短了31%,润湿力较基体的提高了3.8%;机械搅拌在破碎树枝晶和加速元素扩散的同时,降低了液相的温度梯度和成分过冷,大大削弱了钎料基体中金属间化合物(IMC)Cu6Sn5的枝晶生长,促使针状Cu6Sn5破碎呈短棒状;在低银无铅钎料中加入纳米Ni颗粒,Ni与Cu6Sn5生成孔洞状化合物(CuxNi1-x)6Sn5及低温搅拌形成的气孔成为界面原子的扩散通道。搅拌形成的紊流和热流传递加快了原子的溶解与扩散,加速了界面IMC的生长。

 

关键字: 纳米Ni增强Sn-Cu-Ag复合钎料;低温钎焊;搅拌;润湿性;金属间化合物

Low-temperature soldering technology with stirring for nano-Ni particle-reinforced lead-free Sn-Cu-Ag composite solders
GAN Gui-sheng1, DU Chang-hua1, XU Hui-bin1, YANG Bin2, LI Zheng-kang1, WANG Tao1, HUANG Wen-chao1

1. School of Materials Science and Engineering, Chongqing University of Technology, Chongqing 400054, China;
2. State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing,
Beijing 100083, China

Abstract:The soldering joints of low silver solder and nano-particle lead-free Sn-Cu-Ag composite solder were prepared by the technology of low-temperature soldering (at semi-solid state) with stirring, respectively. The results show that the wetting time of nano-particle composite solder is decreased by 31% at 240 ℃, and the wetting power is increased by 3.8% compared those of with the matrix. Mechanical mixing can break dendrites and accelerate the diffusion of elements, and also reduce the temperature gradient and the composition undercooling of the liquid, thus, greatly weaken the growth of IMC-Cu6Sn5 dendrite in solder matrix and making needle-shaped intermetallic compound (IMC) Cu6Sn5 break into short rod-like. After adding nano-Ni particles into the low silver solder, cavitary compounds of (CuxNi1-x) 6 Sn5 generated by Ni with Cu6Sn5 and the porosities formed by stirring at low temperature are as the diffusion path of interface atoms. The turbulent flow and heat flow due to stirring accelerate the dissolution and diffusion of the atom, and speed up the growth of IMC.

 

Key words: nano-Ni particle Sn-Cu-Ag composite solders; low-temperature soldering; stirring; wettability; intermetallic compound

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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