Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报(英文版)

Transactions of Nonferrous Metals Society of China

Vol. 23    No. 8    August 2013

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5-methyl-1H-benzotriazole as potential corrosion inhibitor for electrochemical-mechanical planarization of copper
Yan-fei BIAN, Wen-jie ZHAI, Bao-quan ZHU

School of Mechatronics Engineering, Harbin Institute of Technology, Harbin 150001, China

Abstract:According to the electrochemical analysis, the corrosion inhibition efficiency of 5-methyl-1H-benzotriazole (m-BTA) is higher than that of benzotrizaole (BTA). The inhibition capability of the m-BTA passive film formed in hydroxyethylidenediphosphonic acid (HEDP) electrolyte containing both m-BTA and chloride ions is superior to that formed in m-BTA-alone electrolyte, even at a high anodic potential. The results of electrical impedance spectroscopy, nano-scratch experiments and energy dispersive analysis of X-ray (EDAX) indicate that the enhancement of m-BTA inhibition capability may be due to the increasing thickness of passive film. Furthermore, X-ray photoelectron spectrometry (XPS) analysis indicates that the increase in passive film thickness can be attributed to the incorporation of Cl- into the m-BTA passive film and the formation of [Cu(I)Cl(m-BTA)]n polymer film on Cu surface. Therefore, the introduction of Cl- into m-BTA-containing HEDP electrolyte is effective to enhance the passivation capability of m-BTA passive film, thus extending the operating potential window.

 

Key words: electrochemical-mechanical planarization; 5-methyl-1H-benzotriazole; corrosion inhibitor; chloride ion

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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