Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报(英文版)

Transactions of Nonferrous Metals Society of China

Vol. 23    No. 6    June 2013

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Brazing diamond/Cu composite to alumina using reactive Ag-Cu-Ti alloy
Mao WU1, Che-zheng CAO1, Rafi-ud-din2, Xin-bo HE1, Xuan-hui QU1

1. State Key Laboratory for Advanced Metals and Materials, Beijing Key Laboratory for Powder Metallurgy and Particulate Materials, University of Science and Technology Beijing, Beijing 100083, China;2. Chemistry Division, PINSTECH, P.O. Box, Nilore, Islamabad, Pakistan

Abstract:The novel properties of diamond/Cu composites such as low thermal expansion coefficient and high thermal conductivity have rendered the composites a valuable packaging material. The reactive brazing of diamond/Cu composites and alumina was performed using the 97%(72Ag-28Cu)-3%Ti alloy. The reactive brazing alloy displays good wettability with alumina and diamond film, and the equilibrium contact angle on both the substrates is found to be less than 5o. The influence of main bonding conditions such as peak heating temperature and holding time was investigated in detail. It is found that Ti element concentrates at the surface of diamond particle resulting in the formation of TiC compound. The morphology of TiC compound exhibits a close relationship with the shear strength of brazing joint. It is surmised that an optimal thickness of TiC layer on the diamond particle surface can ameliorate the shear strength of brazing joint. However, on the contrary, the particle-like shaped TiC compound or a thicker TiC compound layer can impair the shear strength. The maximum shear strength is found to be 117 MPa.

 

Key words: wetting; diamond/Cu composites; Ag-Cu-Ti brazing filler; reactive brazing; shear strength

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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