Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第23卷    第1期    总第166期    2013年1月

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文章编号:1004-0609(2013)01-0219-10
基于电磁场与流场耦合的电沉积加工过程仿真
吴蒙华,刘新功,王元刚,贾卫平

(大连大学 机械工程学院,大连 116622)

摘 要: 在电沉积过程中运用COMSOL Multiphysics建立电磁场、流场的数学模型,将有限元和有限差分相结合进行电磁场和流场的耦合模拟分析,研究磁场对流场、电流密度分布、镀层表面形貌、晶粒及SiC含量的影响规律,并进行预测与验证。结果表明:施加平行磁场时,磁感应强度在极头之间分布均匀,溶液呈现不规则的运动,镀层厚度预测值的最小误差为1.84%,镀层的晶粒尺寸随着磁感应强度的增大而细化;施加垂直磁场时,两极头间区域的磁感应强度较强,溶液呈现漩涡流动,且流速随磁场感应强度的增大而增大。XRD分析表明:在所研究磁感应强度范围内磁场对晶粒的取向没有明显的影响,镀层中SiC含量随着磁感应强度的增大而增加。

 

关键字: 磁场;流场;耦合;电沉积;数值分析

Simulation of electrodeposition process based on electromagnetic coupling with flow field
WU Meng-hua, LIU Xin-gong, WANG Yuan-gang, JIA Wei-ping

College of Mechanical Engineering, Dalian University, Dalian 116622, China

Abstract:The mathematical models of the electromagnetic field and the flow field in process of electrode positions were established by COMSOL Multiphysics. The simulation analysis of coupling electromagnetic field and flow field was realized by combining finite element and finite difference. The influences of the magnetic field on the flow field, distribution of current density, morphology of coating surface, grain size and SiC content were studied. The prediction and validation were conducted. The results show that the magnetic flux density between the poles is uniform distribution and the solution appears irregular movement in the parallel magnetic field, and the predictive value of minimum error of coating thickness is 1.84%. The grain size of coating is refinement with the increase of magnetic flux density. The magnetic flux density between the poles is stronger, and the solution presents the swirl flow and the flow rate increases with the magnetic flux density increasing in the vertical magnetic field. It is obtained by XRD analysis that the magnetic field has no significant impact on the grain orientation in the studied range of magnetic flux density. The SiC content in the coating increases with the magnetic flux density increasing.

 

Key words: magnetic field; flow field; coupling; electrodeposition; numerical analysis

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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