(中南大学 材料科学与工程学院，长沙 410083)
摘 要: 阐述电子封装材料的基本要求，论述高硅铝合金材料的研究概况及其性能特点，分析熔炼铸造、浸渗法、快速凝固/粉末冶金和喷射沉积制备方法的优缺点，并指出高硅铝合金电子封装材料的发展方向。
关键字: 高硅铝合金；电子封装；性能；熔炼铸造；浸渗法；喷射沉积
（School of Materials Science and Engineering, Central South University, Changsha 410083, China）
Abstract:Basic requirements of electronic packaging materials were reviewed, the characteristics and research situation of the high aluminum-silicon alloys were discussed, and the advantages and disadvantages of the preparation processes that include casting, infiltration, rapid solidification powder metallurgy and spray-forming were analyzed. Moreover, the development tendency of high aluminum-silicon alloy electronic packaging materials was pointed out.
Key words: high silicon aluminum alloy; electronic packaging; casting; infiltration; spray-forming
