(1. 中南大学 材料科学与工程学院，长沙 410083；
2. 中南大学 有色金属材料科学与工程教育部重点实验室，长沙 410083)
摘 要: 采用熔铸、轧制的方法制备Zn-1.0Cu-0.2Ti合金，借助扫描电子显微镜(SEM)、透射电子显微镜(TEM)观察合金的显微组织，测定不同退火制度后合金的硬度和再结晶晶粒尺寸，建立了Zn-1.0Cu-0.2Ti合金的再结晶晶粒长大模型，研究退火温度和退火时间对Zn-1.0Cu-0.2Ti合金再结晶行为的影响。利用硬度法测得Zn-1.0Cu-0.2Ti合金的再结晶温度在230 ℃左右。结果表明：随着退火温度的升高和退火时间的延长，合金再结晶晶粒均逐渐长大，但晶粒长大的速度趋于缓慢，合金中弥散分布于基体内的CuZn4和TiZn15相能够抑制再结晶晶粒的长大。
关键字: Zn-1.0Cu-0.2Ti合金；再结晶；退火；显微组织
（1. School of Materials Science and Engineering, Central South University, Changsha 410083, China;
2. Key Laboratory of Non-ferrous Metal Materials Science and Engineering, Ministry of Education,
Central South University, Changsha 410083, China）
Abstract:Zn-1.0Cu-0.2Ti alloy were prepared by casting and rolling processes. The microstructures of alloy were investigated by SEM and TEM. The recrystallized grain size and Vickers hardness were measured after different annealing processes. The recrystallized grain growth model was founded. The influence of annealing temperature and annealing time on the recrystallization behavior of Zn-1.0Cu-0.2Ti alloy were studied. The recrystallization temperature of Zn-1.0Cu-0.2Ti is about 230 ℃ by measuring the hardness of alloy. The result shows that the recrystallized grain of Zn-1.0Cu-0.2Ti alloys grows with the increase of annealing temperature and time, while the growing rate decreases. The second phases CuZn4 and TiZn15 help to suppress the growth of the recrystallized grains.
Key words: Zn-1.0Cu-0.2Ti alloy; recrystallization; annealing; microstructure
