Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第21卷    第5期    总第146期    2011年5月

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文章编号:1004-0609(2011)05-0988-07
含钪Al-Cu-Li-Zr合金的热变形行为及组织演化
梁文杰1,2,潘清林2,何运斌2

(1. 中南大学 化学化工学院,长沙 410083;2. 中南大学 材料科学与工程学院,长沙 410083)

摘 要: 在实验温度范围为380~500 ℃、应变速率范围为0.001~10.0 s−1,采用Gleeble−1500热模拟机,对含钪Al-Cu-Li-Zr合金的高温热变形行为进行研究,采用金相显微镜和透射电镜观察合金在压缩变形时的组织变化。结果表明:变形温度和应变速率的变化强烈影响合金的流变应力,合金的流变应力随变形速率的增加而增大,随变形温度的升高而降低,可用包含Arrhenius项的Zener-Hollomon参数描述合金在高温压缩变形时的流变应力行为。当合金在温度低于440 ℃变形时,合金中主要形成亚晶组织,仅发生动态回复;在ln Z≤36.7变形时,合金发生部分动态再结晶,其动态再结晶形核机制主要为晶界弓出和亚晶合并形核。

 

关键字: 含钪Al-Cu-Li-Zr合金; 热压缩变形; 动态回复; 动态再结晶

Hot deformation behavior and microstructural evolution of
Al-Cu-Li-Zr alloy containing Sc
LIANG Wen-jie1, 2, PAN Qing-lin2, HE Yun-bin2

1. School of Chemistry and Chemical Engineering, Central South University, Changsha 410083, China;
(2. School of Materials Science and Engineering, Central South University, Changsha 410083, China

Abstract:The deformation behavior of Al-Cu-Li-Zr alloy containing Sc was investigated with compression tests in the temperature range of 380−470 ℃ and the strain rate range of 0.001−10.0 s−1 using Gleeble−1500 system, and the associated microstructural evolutions was studied by metallographic microscopy and transmission electron microscopy. The results indicate that the flow stress of the alloy increases with increasing strain rate at a given temperature, and decreases with increasing temperature at a given imposed strain rate. The flow stress of the alloy during the elevated temperature deformation can be represented by a Zener-Hollomon parameter with the inclusion of Arrhenius term. At 440 ℃, the hot deformation structure of the alloy is mainly the sub-grain structure, and when ln Z≤36.7, the dynamic recrystallization occurs in the alloy. The nucleation mechanism of recrystallizing process is grain-boundary protrude and subgrain coalescence.

 

Key words: Al-Cu-Li-Zr alloy containing Sc; hot compression deformation; dynamic recovery; dynamic recrystallization

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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