Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第20卷    第10期    总第139期    2010年10月

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文章编号:1004-0609(2010)10-2025-07
快速凝固Sn2.5Ag0.7Cu钎料中金属间化合物的
形态及对焊点性能的影响
赵国际1, 2,张柯柯3,罗  键2

(1. 重庆大学 材料科学与工程学院,重庆 400044;2. 重庆大学 机械传动国家重点实验室,重庆 400044;
3. 河南科技大学 材料科学与工程学院,洛阳 471003
)

摘 要: 利用SP009A型半自动非金属系制造器,通过铜制单辊快淬工艺制得快速凝固态Sn2.5Ag0.7Cu钎料合金薄带,采用JSM−5610LV 扫描电镜及能谱仪,研究快速凝固态钎料合金的微观形貌及金属间化合物(IMC)特征;通过钎焊接头组织与剪切断口分析,研究IMC对钎焊接头韧性的影响机制。结果表明:快速凝固态钎料合金焊点界面处形成的排列紧密的小尺寸β-Sn能有效抑制界面处IMC Cu6Sn5的长大;在钎焊过程中,钎料中过饱和固溶体析出大量尺寸细小、弥散分布的金属间化合物Cu6Sn5和Ag3Sn,凝固时可作为第二相粒子与初生相混杂在一起,形成细小共晶组织分布于钎缝中,改善了焊点韧性。

 

关键字: Sn2.5Ag0.7Cu;钎料;金属间化合物;快速凝固;钎焊

Micro-morphology of intermetallic compounds in rapid solidification
Sn2.5Ag0.7Cu solder alloy and its effects on performance of solder joint
ZHAO Guo-ji1, 2, ZHANG Ke-ke3, LUO Jian2

1. School of Materials Science and Engineering, Chongqing University, Chongqing 400044, China;
2. The State Key Laboratory of Mechanical Transmission, Chongqing University, Chongqing 400044, China;
3. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471003, China

Abstract:Rapid solidification Sn2.5Ag0.7Cu solder alloy ribbons were produced by single copper roller process with SP009A semi-automatic nonmetal series fabricate machine, and the micro-morphology and properties of intermetallic compound (IMC) were studied by JSM−5610LV scanning electronic microscope and energy spectrum analyzer. Through the analysis on the microstructure and shear fracture of the soldering joint, the influence mechanism of IMC on the toughness of soldering joint was studied. The results show that,in solder joint by using rapid solidification solder alloy, small size β-Sn tight arrangement at the interface can effectively inhibit the growth of IMC Cu6Sn5, and the IMC Cu6Sn5 and Ag3Sn in the supersaturated solid solution with small size and dispersive distribution massively precipitate as the second phase particle confounding with the primary phase during the solidification process to form fine eutectic structure in the soldering beam, and the toughness of soldering joint is improved.

 

Key words: Sn2.5Ag0.7Cu; solder; intermetallic compound (IMC); rapid solidification; soldering

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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