(中南大学 粉末冶金国家重点实验室,长沙 410083)
摘 要: 以喷雾干燥−氢还原W-10%Cu(质量分数)、W-20%Cu、W-30%Cu细晶复合粉末为原料,制备工字型拉伸样,并对粉末成分、烧结温度、保温时间对电导率的影响进行研究。结果表明:3种合金中,在1 420 ℃时W-10%Cu和W-20%Cu的相对密度较大,达99.1%;在1 380 ℃时W-30%Cu出现明显的致密化,相对密度最大,达98.7%。1 420 ℃烧结1.5 h后材料电导率达到最大,W-10%Cu、W-20%Cu、W-30%Cu的导电率分别为19、25、30 MS/m,分别超过GB/T 8320—2003的21.8%、27.2%、23.6%。
关键字: 超细W-Cu合金;电导率;致密化;微观组织
(State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, China)
Abstract:Ultrafine W-10%Cu (mass fraction), W-20%Cu and W-30%Cu composite powders were synthesized by sol-spray drying and subsequent hydrogen reduction process, and then the obtained powders were die-pressed into I-shaped compacts. The effects of powder composition, sintering temperature and holding time on the electric conductivity were investigated. The results show that among the three alloys, the higher relative densities of the W-10%Cu and W-20%Cu compacts can be obtained at 1 420 ℃ and both the values are 99.1%; significant densification occurs at 1 380 ℃ for the W-30%Cu compact and the maximum relative density is approximately 98.7%. When sintered at 1 420 ℃ for 1.5 h, the electric conductivities of W-10%Cu, W-20%Cu and W-30%Cu compacts reach the maximums of 19, 25 and 30 MS/m, which are 21.8%, 27.2% and 23.6% higher than those of GB/T 8320—2003, respectively.
Key words: ultrafine W-Cu alloy; electric conductivity; densification; microstructure