(1. 大连理工大学 材料科学与工程学院，大连 116024；
2. 大连理工大学 辽宁省先进连接技术重点实验室，大连 116024)
摘 要: 研究磷含量为6.5%(质量分数)的化学镀Ni-P薄膜与Sn-3.5Ag钎料合金之间的润湿行为，以及Sn-3.5Ag/Ni-P焊点在钎焊和时效过程中的界面反应。结果表明：250 ℃时，直径为(2.3±0.06) mm的Sn-3.5Ag焊球在化学镀Ni-6.5%P薄膜上钎焊后得到的润湿角约为44˚，铺展率约为67%；焊点界面由Ni3Sn4 IMC层、及较薄的Ni-Sn-P过渡层构成Ni3P晶化层；钎焊过程中界面Ni3Sn4 IMC的生长速率与钎焊时间t1/3呈线性关系；时效过程中界面Ni3Sn4 IMC及富P层的生长速率与时效时间t1/2呈线性关系。
关键字: 化学镀Ni-P薄膜；Sn-3.5Ag钎料；界面反应；钎焊；时效
中图分类号：TQ153.2 文献标志码：A
electroless Ni-P during soldering and aging
（1. School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China;
2. Key Laboratory of Liaoning Advanced Welding and Joining Technology,
Dalian University of Technology, Dalian 116024, China）
Abstract:The wetting behavior of Sn-3.5Ag solder on the electroless Ni-P film with 6.5% P (mass fraction) during soldering and the interfacial reactions between Sn-3.5Ag solder and electroless Ni-6.5% P during soldering and aging were investigated. The results show that the wetting angle is about 44˚ and the spreading coefficient is about 67% using the solder balls with diameter of (2.3±0.06) mm at 25 ℃. The soldering interface are composed of a Ni3Sn4 IMC layer, a thinner Ni-Sn-P layer and a Ni3P crystallization layer between Sn-3.5Ag solder and electroless Ni-P. The growth kinetics of the interfacial IMC Ni3Sn4 during soldering follows a linear relation with cubic root of soldering time. The growth kinetics of interfacial IMC Ni3Sn4 and P-enriched layer during aging obeys a linear relation with square root of aging time.
Key words: electroless Ni-P film; Sn-3.5Ag solder; interfacial reaction; soldering; aging
