(1.北京科技大学化学系，北京100083；
2.北京航空航天大学材料科学系，北京100083)
摘 要: 采用计算机采样等实验手段，研究了外电场在诱发非催化活性金属铜表面产生化学镀镍过程中的作用。研究结果表明，当铜基体电位等于或低于临界诱发电位时才有可能引发化学镀自催化沉积。试样的表面状况、溶液条件和通电电流密度都对临界诱发时间有影响。铜基体达到临界诱发电位-0.520V (vs SCE)和临界诱发时间是引发化学镀镍成功的必要和充分条件。计算表明，新生的镍原子如果以单原子层覆盖铜表面，其覆盖率大约为12%就足以诱发化学镀镍自催化过程。
关键字: 电场诱发 化学镀镍 诱发过程
PROCESS OF ELECTROLESS NICKEL PLATING
（1.University of Science and Technology Beijing, Beijing100083
2.University of Aeronautics and Astronautics Beijing, Beijing100083）
Abstract:The induction of electroless Ni-P deposition on copper substrate by virtue of the external direct electric field was investigated. The data acquisition was carried out by microcomputer. The experimental results indicate that: (1) The potential of copper substrate has to be equal to or more negative than the critical induction potential -0.520 V (vs SCE), otherwise the deposition of electroless nickel would not occur; (2) The critical induction time depends on the
surface state of the sample, the solution and the current density; (3) Surface coverage of 12% is enough for the substantial initiation of the electroless deposition, if the newborn nickel atoms are deposited in the form of monolayer.
Key words: electric field electroless nickel plating induction process
