文章编号：(1996)01-44-5
PZT陶瓷表面金属化的研究①
(IV)后处理的实施及其作用②
(IV)后处理的实施及其作用②
(同济大学化学系，上海200092)
摘 要: 利用化学镀方法在PZT陶瓷表面制得的镀镍层，必须经过后处理才能最后完成PZT陶瓷表面金属化过程，以制成合用的镍电极。后处理包括电镀镍及低温、高温热处理等步骤。本文报导了这种后处理的实施过程、控制条件及其结果，并讨论了后处理对于PZT陶瓷表面金属化及对PZT陶瓷元器件的电学性能的影响。
关键字: PZT陶瓷表面 电镀镍 热处理
METALLIZATION OF PZT CERAMIC SURFACE(IV)POST-TREATMENTS AND THEIR EFFECTS ON METALLIZATION
（Chemistry Department，Tongji University，Shanghai 200092）
Abstract:The plated Ni layer on PZT ceramics by electroless plating must be carried out a post-treatment,which involved a Ni-electroplating process and double step heat-treatments at 200℃in air and at 400~460℃ in N2 atmosphere respectively. The experimental procedures of the post-treatment were investigated, and its effects on the metallization of PZT ceramic surface and the properties of the PZT ceramic components were discussed too.
Key words: PZT ceramic surface electroplating heat-treatment
