文章编号：(1997)01-169-3
热处理对硅片抗弯强度的影响
(1.中南工业大学应用物理及热能工程系;
2.测试分析中心，长沙 410083)
摘 要:
关键字: 硅 抗弯强度 热处理
EFFECT OF HEAT TREATMENT ON FLEXURE STRENGTH OF SILICON WAFER
（1.Department of Applied Physics and Heat Engineering,
2.Central South University of Technology, Changsha 410083）
Abstract:The effects of heat treatment temperature, time and cooling way on the flexure strength of ACZ and NCZ silicon wafers with various contents of oxygen and nitrogen were studied. The strength of silicon wafer was increased by the formation of silicon-oxygen and nitrogen-silicon-oxygen complexes and was decreased by the formation of silicon-oxygen and nitrogen-silicon-oxygen precipitates. A new two step cooling technique eliminating heat donor and preventing the decrease of strength was suggested.
Key words: silicon flexure strength heat treatment
