(华东船舶工业学院焊接系，镇江 212003
浙江大学材料系，杭州 310027
华南理工大学机械系，广州 510641)
摘 要: 在温度为1 273～1423 K、时间为0.9～7.2 ks和0.1 MPa压应力的条件下进行了Si3N4 /Ti/Ni/Ti/Si3N4的部分瞬间液相连接，结合SEM，EDS和XRD测试结果，分析了连接温度和时间对接头常温四点弯曲强度和断裂方式的影响。通过用反应层厚度来表征界面强度，用 σθmaxRes来评价近界面陶瓷断裂，用σθ=0Res来评价界面断裂，建立了界面强度、陶瓷强度和残余应力与接头强度和三种断裂类型的关系模型。
关键字: 界面强度 接头强度 残余应力
（Department of Welding, East China Shipbuilding Institute,Zhenjiang 212003, P. R. China
Department of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, P. R. China
Department of Mechanical, South China University of Science and Technology, Guangzhou 510641, P. R. China）
Abstract:Partial transient liquid-phase bonding was performed using Ti/Ni/Ti multi-interlayers on Si3N4 ceramic under the conditions of temperature 1273～1423 K, time of 0.9～7.2 ks and pressure of 0.1 MPa in a vacuum. The effects of bonding temperature and time on four-point bending strength and fracture type of the joints were investigated, based on the experimental results by SEM, EDS and XRD analyses. By using the thickness of reaction layer to characterize the interfacial strength, using residual stress σθmaxRes to evaluate the fracture in ceramic near the interface, and using residual stress σθ=0Res to evaluate the fracture along the interface, a model has been proposed to describe the relationship between interfacial strength, ceramic strength, residual stress and joint strength, and three fracture types.
Key words: interfacial strength; joint strength; residual stress
