——应力—应变场分布特征及其动态特性
(1. 哈尔滨工业大学 现代焊接生产技术国家重点实验室， 哈尔滨 150001；
2.广岛大学 工学部弹塑性工学研究室， 日本， 739)
摘 要: 针对表面组装焊点的实际服役条件， 对温度循环载荷下其内部应力—应变场的分布特征进行了有限元数值模拟。结果表明，温度循环在焊点内部导致应力循环，应力循环导致热棘轮效应，即非弹性应变累积；在温度历史过程中， 应力—应变场等值分布图呈现动态特性， 且与温度历史相关。
关键字: 温度循环载荷； 表面组装焊点； 应力—应变场；动态特性； 有限元数值模拟
characteristics in SMT solder joints (Ⅰ)
——Dynamic feature of stressstrain field distribution
（1. National Key Laboratory of Welding, Harbin Institute of Technology, Harbin 150001, P.R.China；
2. Department of Mechanical Engineering, Hiroshima University, HigashiHiroshima, 739, Japan）
Abstract:Based on the real service conditions of surface mount solder joints, the finite element numerical simulation was made in order to get the feature of stressstrain distribution in the solder joints under temperature cycling. Analysis results show that temperature cycling leads to stress cycling and the later leads to thermal ratchetting effect and the accumulation of inelastic strain. Furthermore, stressstrain distribution in the solder joints has dynamic feature during temperature cycling and is related to temperature history.
Key words: temperature cycling load； surface mount solder joints； stressstrain field； dynamic feature； finite element numerical simulation
